Title :
Composition, structure and optical properties of aluminum nitride films formed by low energy ion beam assisted deposition
Author :
Ensinger, W. ; Kiuchi, M.
Author_Institution :
Dept. of Chem., Marburg Univ., Germany
Abstract :
Thin films of aluminum nitride are of interest for a variety of applications in different fields, including optoelectronics, microelectronics, surface acoustic wave devices, and tribology. This is due to its favourable features such as high electrical resistivity, high thermal conductivity, wide band gap, high ultrasonic velocity, high hardness, high melting point and chemical inertness. Owing to its excellent controllability and reproducibility, ion beam assisted deposition is favourable technique for depositing AlN. In the present contribution, results on properties of AlN films formed by condensation of aluminum metal under concurrent bombardment with nitrogen ions with low energy on substrates of silicon and fused quartz at elevated temperature are presented. The films become stoichiometric in their composition when the ion-to-atom arrival ratio exceeds 1.3, These films exhibit a c-axis orientation in growth direction. They are highly optical transparent and electrically nonconductive
Keywords :
III-V semiconductors; aluminium compounds; crystal structure; electrical conductivity; ion beam assisted deposition; light transmission; semiconductor growth; semiconductor thin films; stoichiometry; wide band gap semiconductors; AlN; Si; SiO2; aluminum nitride films; c-axis orientation; chemical inertness; composition; electrically nonconductive films; fused quartz; high electrical resistivity; high hardness; high melting point; high thermal conductivity; high ultrasonic velocity; ion-to-atom arrival ratio; low energy ion beam assisted deposition; optical properties; optical transparent films; silicon; stoichiometric composition; structure; wide band gap; Acoustic waves; Aluminum nitride; Electric resistance; Microelectronics; Optical films; Optical surface waves; Surface acoustic wave devices; Thermal conductivity; Thin film devices; Tribology;
Conference_Titel :
Ion Implantation Technology Proceedings, 1998 International Conference on
Conference_Location :
Kyoto
Print_ISBN :
0-7803-4538-X
DOI :
10.1109/IIT.1998.813856