• DocumentCode
    3437995
  • Title

    Anti-resonance peak damping of PDN impedance by on-board snubber circuits

  • Author

    Iijima, Y. ; Matsumura, Mieko ; Sudo, Toshio

  • Author_Institution
    Shibaura Inst. of Technol., Tokyo, Japan
  • fYear
    2012
  • fDate
    9-11 Dec. 2012
  • Firstpage
    127
  • Lastpage
    130
  • Abstract
    Simultaneous switching noise (SSN) is a serious design issue to stabilize logic operation and to reduce electromagnetic interference (EMI) in advanced CMOS circuits and systems. Ringing frequency observed in the SSN waveforms is strongly related to the anti-resonance peak frequency of total PDN impedance. In this paper, on-board snubber (RC series circuit) was investigated to improve power supply integrity in a FPGA (Field Programmable Gate Array) board. The on-board snubber circuits was added just at the beneath of the power supply terminals of the FPGA to effectively suppress the anti-resonance peak of the total PDN impedance. Design space to damp the anti-resonance peak was examined. In particular, the values of on-board capacitance and resistance of snubber circuit has been examined by using circuit analysis tool and field solver.
  • Keywords
    CMOS logic circuits; damping; electric impedance; electromagnetic interference; field programmable gate arrays; network analysis; on-board communications; power supplies to apparatus; snubbers; EMI; FPGA board; PDN impedance; SSN waveforms; advanced CMOS circuits; antiresonance peak damping; antiresonance peak frequency; circuit analysis tool; electromagnetic interference; field programmable gate array board; logic operation stabilization; on-board capacitance; on-board resistance; on-board snubber; on-board snubber circuits; power supply integrity; power supply terminals; serious design; simultaneous switching noise; Capacitance; Field programmable gate arrays; Impedance; Integrated circuit modeling; Power supplies; Snubbers; Transmission line measurements;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2012 IEEE
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4673-1444-2
  • Electronic_ISBN
    978-1-4673-1445-9
  • Type

    conf

  • DOI
    10.1109/EDAPS.2012.6469429
  • Filename
    6469429