Title :
Avalanche current induced hot carrier degradation in 200 GHz SiGe heterojunction bipolar transistors
Author :
Yang, Zhijian ; Guarin, Femando ; Hostetter, Ed ; Freeman, Greg
Author_Institution :
IBM Microelectron., Hopewell Junction, NY, USA
fDate :
30 March-4 April 2003
Abstract :
SiGe heterojunction bipolar transistors (HBTs) have been investigated under accelerated avalanche stress conditions, where the base-emitter junction is forward biased, while the collector-base junction is reverse biased under avalanche conditions. The high energy avalanche carriers (hot carriers) introduce damage at Si-SiO2 interfaces and degrade the characteristics of the SiGe HBTs. A new model has been developed to predict the damage at the Si-SiO2 interface. The DC degradation of the base current is shown to correlate with the injected charge total and corresponding energy. The change of base current dependence on avalanche charges and applied voltage is shown, and a model is used to predict the parameter degradation within a typical digital switching application. The impact of this degradation mechanism to fT has also been studied and found not to be significant.
Keywords :
Ge-Si alloys; avalanche breakdown; heterojunction bipolar transistors; hot carriers; millimetre wave bipolar transistors; semiconductor device breakdown; semiconductor device models; semiconductor device reliability; semiconductor materials; submillimetre wave transistors; 200 GHz; 200 GHz SiGe heterojunction bipolar transistors; Si-SiO2; Si-SiO2 interface; SiGe; SiGe BiCMOS technology; SiGe HBT technology; accelerated avalanche stress conditions; avalanche charges; avalanche current induced hot carrier degradation; base current DC degradation; digital switching application; forward biased base-emitter junction; high energy avalanche carriers; hot carriers; injected charge; model; parameter degradation; reverse biased collector-base junction; Breakdown voltage; Circuits; Degradation; Germanium silicon alloys; Heterojunction bipolar transistors; Hot carriers; Microelectronics; Predictive models; Silicon germanium; Stress;
Conference_Titel :
Reliability Physics Symposium Proceedings, 2003. 41st Annual. 2003 IEEE International
Print_ISBN :
0-7803-7649-8
DOI :
10.1109/RELPHY.2003.1197770