Heterodyne electrostatic force microscopy used as a new non-contact test technique for integrated circuits

Author

Said, Ra´a ; Bridges, Greg

Author_Institution

Dept. of Electr. & Comput. Eng., Manitoba Univ., Winnipeg, Man., Canada

Volume

2

fYear

1995

fDate

15-16 May 1995

Firstpage

483

Abstract

In this paper a new high-resolution non-contact scanned probe voltage measurement technique for integrated circuits is presented. Voltages are extracted by sensing the localized electrostatic force between an energized probe and a point on the circuit being tested. Using a nulling method, the technique is capable of accurate magnitude measurements of high frequency signals without complex calibration requirements. An instrument based on the developed technique has been constructed and RF vector waveform measurement of a GaAs MMIC at 1 GHz as well as arbitrary waveform sampling of a CMOS circuit is demonstrated

Keywords

demodulation; electrostatic devices; integrated circuit testing; microscopy; scanning probe microscopy; voltage measurement; 1 GHz; CMOS circuit; GaAs; GaAs MMIC; RF vector waveforms; heterodyne electrostatic force microscopy; high frequency signals; high-resolution scanned probe voltage measurement; integrated circuits; noncontact testing; nulling method; pulse sampling; Calibration; Circuit testing; Electrostatic measurements; Frequency measurement; Instruments; Integrated circuit measurements; Microscopy; Probes; Radio frequency; Voltage measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

WESCANEX 95. Communications, Power, and Computing. Conference Proceedings., IEEE

Conference_Location

Winnipeg, Man.

Print_ISBN

0-7803-2725-X

Type

conf

DOI

10.1109/WESCAN.1995.494078

Filename

494078