A novel flexible printed circuit structure for gigabit data transmission

Author

Shou-Kuo Sogo Hsu ; Yu-Chang Pai ; Po-Chuan Hsieh

Author_Institution

Cloud Enterprise Solutions Bus. Group, Foxconn Technol. Group, New Taipei, Taiwan

fYear

2012

fDate

9-11 Dec. 2012

Firstpage

153

Lastpage

156

Abstract

In order to improve the electrical channel designs with FPC board, a novel FPC structure is proposed in this work. The new transmission line structure not only shows the merit of precise impedance control of FPC board but also avoids the common-mode issue which arises from the meshed ground. Moreover, the new transmission line structure is compatible with the traditional FPC manufacturing process and can be manufactured without extra cost. This proposed structure was validated with 3D EM simulation and experiment, and assured of the feasibility and practiced in mass production to implement PCI-Express signals on FPC successfully.

Keywords

flexible electronics; printed circuits; 3D EM simulation; FPC board; FPC manufacturing process; FPC structure; PCI express signal; common mode issue; electrical channel design; flexible printed circuit structure; gigabit data transmission; mass production; precise impedance control; transmission line structure; Coplanar transmission lines; Flexible printed circuits; Impedance; Noise; Packaging; Solid modeling; Transmission line measurements; Flexible printed circuit (FPC); TDR/TDT; common-mode noise; coplanar transmission line;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2012 IEEE

Conference_Location

Taipei

Print_ISBN

978-1-4673-1444-2

Electronic_ISBN

978-1-4673-1445-9

Type

conf

DOI

10.1109/EDAPS.2012.6469437

Filename

6469437