• DocumentCode
    3438409
  • Title

    Thermal Aging Study of Tin plating on Aluminum

  • Author

    Chudnovsky, Bella ; Pavageau, Vincent ; Rapeaux, Michel ; Zolfaghari, Ali ; Bardollet, Pierre

  • Author_Institution
    Schneider Electr. North America, Chester
  • fYear
    2007
  • fDate
    16-19 Sept. 2007
  • Firstpage
    82
  • Lastpage
    89
  • Abstract
    This paper presents a thermal study of aluminum with tin plating deposited on Al using three different types of tin plating using various cyanide and non-cyanide processes. We determined the quality of plating before and after it was exposed to the temperature of 150degC in air for up to eight weeks using multiple testing techniques, such as adhesion test, thermal shock test, SEM techniques, EDS X-ray analysis, and thickness measurements. We determined that after aging test tin plating shows aging related cracks, voids and separation appearing at the plating interfaces although in different concentration and progression rates depending on plating technique. All types of plating demonstrated deteriorated plating adhesion. Accelerated thermal aging tests at 150degC discriminate plating types. Aged samples exhibit medium to poor adhesion characteristics, and these results are likely related to the plating process itself. At the origin of this behavior, we might suggest thermal- induced mechanisms including formation of intermetallics and diffusion, presence of impurities at the plating-bar interface, defect propagation and stress relaxation at the interface.
  • Keywords
    X-ray chemical analysis; ageing; aluminium; cracks; electroplating; scanning electron microscopy; Al; EDS; SEM; Sn; X-ray analysis; adhesion test; cracks; defect propagation; diffusion; stress relaxation; temperature 150 degC; thermal aging; thermal shock test; tin plating; voids; Accelerated aging; Adhesives; Aluminum; Electric shock; Life estimation; Temperature; Testing; Thermal stresses; Thickness measurement; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical contacts - 2007, the 53rd ieee holm conference on
  • Conference_Location
    Pittsburgh, PA
  • Print_ISBN
    1-4244-0837-7
  • Electronic_ISBN
    1-4244-0838-5
  • Type

    conf

  • DOI
    10.1109/HOLM.2007.4318199
  • Filename
    4318199