A simple model for the mode II popcorn effect in thin plastic IC packages

Author

Alpern, Peter ; Lee, K.C.

Author_Institution

Corporate Assembly & Testing, Infineon Technol. AG, Munich, Germany

fYear

2003

fDate

30 March-4 April 2003

Firstpage

452

Lastpage

457

Abstract

A simple model for the mode II popcorn effect is presented here for thin packages, e.g. TSSOP, TQFP. A package "stability parameter", relating to its moisture sensitivity, is derived from the popcorn model. It describes the critical factors for a robust package die-attach, mold compound properties and package, die and lead frame design for a given preconditioning and soldering process. Furthermore, nomograms generated from the model enable an easy estimation of the moisture sensitivity level of products with different die sizes for a given die pad size and package configuration for soldering temperatures up to 260°C (Pb-free soldering).

Keywords

integrated circuit modelling; integrated circuit packaging; integrated circuit reliability; microassembling; moisture; nomograms; plastic packaging; reflow soldering; sensitivity analysis; 260 C; PCB reflow soldering; TQFP; TSSOP; critical factors; die pad size; die sizes; lead frame design; mode II popcorn effect; moisture sensitivity; mold compound properties; nomograms; package configuration; package design; package stability parameter; plastic packaged integrated circuits; preconditioning process; robust package die-attach; soldering process; soldering temperatures; thin plastic IC packages; Delamination; Integrated circuit modeling; Lead; Moisture; Plastic integrated circuit packaging; Plastic packaging; Semiconductor device packaging; Soldering; Temperature sensors; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium Proceedings, 2003. 41st Annual. 2003 IEEE International

Print_ISBN

0-7803-7649-8

Type

conf

DOI

10.1109/RELPHY.2003.1197790

Filename

1197790