Title :
Trends in the development of MMICs and packages for active electronically scanned arrays (AESAs)
Author_Institution :
Palisades Inst. for Res. Services Inc., Arlington, VA, USA
Abstract :
This paper describes current activities and progress toward developing microwave monolithic integrated circuits (MMICs) and multi-chip module assemblies, that will result in the availability of active electronically scanned arrays (AESAs) which achieve required performance characteristics at substantially reduced costs. The paper contains discussions of MMIC cost and development factors, module cost and development considerations, and overall array cost and development considerations
Keywords :
III-V semiconductors; MMIC; array signal processing; economics; electronic warfare; gallium arsenide; integrated circuit manufacture; multichip modules; EW; GaAs; MMIC; active electronically scanned arrays; array cost; costs; microwave monolithic integrated circuits; module cost; multichip module assemblies; packages; performance characteristics; Costs; Electronics packaging; Gallium arsenide; Integrated circuit packaging; MMICs; Manufacturing; Microwave antenna arrays; Monolithic integrated circuits; Phased arrays; Solid state circuits;
Conference_Titel :
Phased Array Systems and Technology, 1996., IEEE International Symposium on
Conference_Location :
Boston, MA
Print_ISBN :
0-7803-3232-6
DOI :
10.1109/PAST.1996.565813