Trends in the development of MMICs and packages for active electronically scanned arrays (AESAs)

Author

Cohen, Eliot D.

Author_Institution

Palisades Inst. for Res. Services Inc., Arlington, VA, USA

fYear

1996

fDate

15-18 Oct 1996

Firstpage

1

Lastpage

4

Abstract

This paper describes current activities and progress toward developing microwave monolithic integrated circuits (MMICs) and multi-chip module assemblies, that will result in the availability of active electronically scanned arrays (AESAs) which achieve required performance characteristics at substantially reduced costs. The paper contains discussions of MMIC cost and development factors, module cost and development considerations, and overall array cost and development considerations

Keywords

III-V semiconductors; MMIC; array signal processing; economics; electronic warfare; gallium arsenide; integrated circuit manufacture; multichip modules; EW; GaAs; MMIC; active electronically scanned arrays; array cost; costs; microwave monolithic integrated circuits; module cost; multichip module assemblies; packages; performance characteristics; Costs; Electronics packaging; Gallium arsenide; Integrated circuit packaging; MMICs; Manufacturing; Microwave antenna arrays; Monolithic integrated circuits; Phased arrays; Solid state circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Phased Array Systems and Technology, 1996., IEEE International Symposium on

Conference_Location

Boston, MA

Print_ISBN

0-7803-3232-6

Type

conf

DOI

10.1109/PAST.1996.565813

Filename

565813