Interconnect and packaging electrical circuits network

Author

Gongo, R.S.N. ; Aubert, H. ; Baudrand, H. ; Lalaurie, J. ; Martins, G.

Author_Institution

ENSEEIHT, Toulouse, France

Volume

2

fYear

1999

fDate

11-16 July 1999

Firstpage

974

Abstract

With the emphasis on a multimodal variational approach in resonant transverse theory, a rigorous method for deriving equivalent electrical circuits are proposed for modeling the connection of planar transmission lines taking into account the shielding effects. The proposed electrical circuits have been implanted in the available CAD circuit with huge success and allows accurate prediction of the planar discontinuities behavior.

Keywords

electromagnetic shielding; equivalent circuits; interconnections; packaging; transmission lines; variational techniques; CAD circuit; circuit interconnection; circuit packaging; electrical circuits network; equivalent electrical circuits; multimodal variational approach; planar discontinuities behavior; planar transmission lines; planar transmission lines connection; resonant transverse theory; shielding effects; Admittance; Apertures; Equivalent circuits; Integrated circuit interconnections; Microwave integrated circuits; Packaging; Planar transmission lines; RLC circuits; Resonance; Transmission line discontinuities;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation Society International Symposium, 1999. IEEE

Conference_Location

Orlando, FL, USA

Print_ISBN

0-7803-5639-x

Type

conf

DOI

10.1109/APS.1999.789475

Filename

789475