Title :
Test structures on MCM active substrate: is it worthwhile?
Author :
Oliver ; Kerkhoff
Author_Institution :
CNM-IMB, Univ. Autonoma de Barcelona, Spain
Abstract :
The miniaturization of electronic systems in areas such as electronic integration and electronic packaging allows the inclusion of devices on reduced substrates constituting a MultiChip Module (MCM). However, with the miniaturization of microsystems big troubles appear in the testing of the MCM. In order to solve the MCM test problem, this paper analyses the cost of using test structures on MCM-Deposited active substrates. Cost results are obtained from yield calculations of test structures placed on active substrate
Keywords :
automatic testing; boundary scan testing; circuit optimisation; fault diagnosis; integrated circuit yield; multichip modules; MCM; active substrate; electronic packaging; test structures; yield calculations; Automatic testing; Circuit faults; Costs; Electronics packaging; Integrated circuit interconnections; Integrated circuit manufacture; Integrated circuit packaging; Multichip modules; Performance evaluation; Silicon;
Conference_Titel :
European Design and Test Conference, 1996. ED&TC 96. Proceedings
Conference_Location :
Paris
Print_ISBN :
0-8186-7424-5
DOI :
10.1109/EDTC.1996.494137
