• DocumentCode
    3438861
  • Title

    ARET for system-level IC reliability simulation

  • Author

    Xuan, Xiangdong ; Chatterjee, Abhijit ; Singh, Adit D.

  • Author_Institution
    Sch. of ECE, Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2003
  • fDate
    30 March-4 April 2003
  • Firstpage
    572
  • Lastpage
    573
  • Abstract
    The simulator ARET (ASIC Reliability Evaluation Tool) is being developed at Georgia Institute of Technology. ARET focuses on system-level reliability with several efficient built-in system-level simulation models. By developing ARET, we are trying to focus on "real world" ICs - ICs with fabrication defects in devices and interconnect - and simulate IC reliability from a system perspective to accomplish design-for-reliability. As the basis of system-level simulation, device-level failure models incorporating physical defects were created and checked with measured data. To accurately evaluate the reliability at system-level, several simulation models were developed by means of circuit simulation, hierarchical analyses and statistical approaches.
  • Keywords
    CMOS integrated circuits; application specific integrated circuits; circuit simulation; electromigration; failure analysis; integrated circuit interconnections; integrated circuit modelling; integrated circuit reliability; ARET; ASIC reliability evaluation tool; analog circuit; built-in system-level simulation models; circuit simulation; design-for-reliability; device-level failure models; digital circuits; fabrication defects; hierarchical analyses; hot carrier-induced CMOS degradation; interconnect electromigration; physical defects; real world ICs; simulation models; statistical approaches; system-level IC reliability simulation; Circuit simulation; Circuit testing; Current density; Degradation; Fabrication; Integrated circuit interconnections; Integrated circuit modeling; Integrated circuit testing; Qualifications; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium Proceedings, 2003. 41st Annual. 2003 IEEE International
  • Print_ISBN
    0-7803-7649-8
  • Type

    conf

  • DOI
    10.1109/RELPHY.2003.1197811
  • Filename
    1197811