• DocumentCode
    3439151
  • Title

    Wafer level reliability monitoring strategy of an advanced multi-process CMOS foundry

  • Author

    Scarpa, Andrea ; Tao, Guoqiao ; Kuper, Fred G.

  • Author_Institution
    Philips Semicond., Nijmegen, Netherlands
  • fYear
    2003
  • fDate
    30 March-4 April 2003
  • Firstpage
    602
  • Lastpage
    603
  • Abstract
    In an advanced multi-process CMOS foundry it is strategically important to make use of an optimum reliability monitoring strategy, in order to be able to run well controlled processes. Philips Semiconductors Business Unit Foundries wafer fab MOS4YOU has developed an end-of-line ultra-fast reliability monitoring strategy, which provides a very fast and continuous feedback to the production line. In this work the advantages of such strategy are discussed by means of example cases, including hot-carrier reliability and a new end-of-line monitoring tool for non-volatile memory reliability.
  • Keywords
    CMOS integrated circuits; MOSFET; flash memories; foundries; hot carriers; integrated circuit manufacture; integrated circuit reliability; process control; process monitoring; NMOSFETs; Philips Semiconductors Business Unit Foundries wafer fab MOS4YOU; advanced multi-process CMOS foundry; end-of-line ultra-fast reliability monitoring strategy; fast continuous feedback; hot-carrier reliability; nonvolatile memory reliability; optimum reliability monitoring strategy; wafer level reliability monitoring strategy; well controlled processes; Circuit testing; Costs; Degradation; Feedback; Foundries; Hot carriers; Monitoring; Packaging; Stress; Wafer scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium Proceedings, 2003. 41st Annual. 2003 IEEE International
  • Print_ISBN
    0-7803-7649-8
  • Type

    conf

  • DOI
    10.1109/RELPHY.2003.1197826
  • Filename
    1197826