DocumentCode
3439151
Title
Wafer level reliability monitoring strategy of an advanced multi-process CMOS foundry
Author
Scarpa, Andrea ; Tao, Guoqiao ; Kuper, Fred G.
Author_Institution
Philips Semicond., Nijmegen, Netherlands
fYear
2003
fDate
30 March-4 April 2003
Firstpage
602
Lastpage
603
Abstract
In an advanced multi-process CMOS foundry it is strategically important to make use of an optimum reliability monitoring strategy, in order to be able to run well controlled processes. Philips Semiconductors Business Unit Foundries wafer fab MOS4YOU has developed an end-of-line ultra-fast reliability monitoring strategy, which provides a very fast and continuous feedback to the production line. In this work the advantages of such strategy are discussed by means of example cases, including hot-carrier reliability and a new end-of-line monitoring tool for non-volatile memory reliability.
Keywords
CMOS integrated circuits; MOSFET; flash memories; foundries; hot carriers; integrated circuit manufacture; integrated circuit reliability; process control; process monitoring; NMOSFETs; Philips Semiconductors Business Unit Foundries wafer fab MOS4YOU; advanced multi-process CMOS foundry; end-of-line ultra-fast reliability monitoring strategy; fast continuous feedback; hot-carrier reliability; nonvolatile memory reliability; optimum reliability monitoring strategy; wafer level reliability monitoring strategy; well controlled processes; Circuit testing; Costs; Degradation; Feedback; Foundries; Hot carriers; Monitoring; Packaging; Stress; Wafer scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium Proceedings, 2003. 41st Annual. 2003 IEEE International
Print_ISBN
0-7803-7649-8
Type
conf
DOI
10.1109/RELPHY.2003.1197826
Filename
1197826
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