DocumentCode :
3439151
Title :
Wafer level reliability monitoring strategy of an advanced multi-process CMOS foundry
Author :
Scarpa, Andrea ; Tao, Guoqiao ; Kuper, Fred G.
Author_Institution :
Philips Semicond., Nijmegen, Netherlands
fYear :
2003
fDate :
30 March-4 April 2003
Firstpage :
602
Lastpage :
603
Abstract :
In an advanced multi-process CMOS foundry it is strategically important to make use of an optimum reliability monitoring strategy, in order to be able to run well controlled processes. Philips Semiconductors Business Unit Foundries wafer fab MOS4YOU has developed an end-of-line ultra-fast reliability monitoring strategy, which provides a very fast and continuous feedback to the production line. In this work the advantages of such strategy are discussed by means of example cases, including hot-carrier reliability and a new end-of-line monitoring tool for non-volatile memory reliability.
Keywords :
CMOS integrated circuits; MOSFET; flash memories; foundries; hot carriers; integrated circuit manufacture; integrated circuit reliability; process control; process monitoring; NMOSFETs; Philips Semiconductors Business Unit Foundries wafer fab MOS4YOU; advanced multi-process CMOS foundry; end-of-line ultra-fast reliability monitoring strategy; fast continuous feedback; hot-carrier reliability; nonvolatile memory reliability; optimum reliability monitoring strategy; wafer level reliability monitoring strategy; well controlled processes; Circuit testing; Costs; Degradation; Feedback; Foundries; Hot carriers; Monitoring; Packaging; Stress; Wafer scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium Proceedings, 2003. 41st Annual. 2003 IEEE International
Print_ISBN :
0-7803-7649-8
Type :
conf
DOI :
10.1109/RELPHY.2003.1197826
Filename :
1197826
Link To Document :
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