• DocumentCode
    3439156
  • Title

    Hydroxy - Functionalized Polyimides as Materials for Advanced Applications

  • Author

    Hamciuc, E. ; Bruma, M. ; Schulz, B. ; Szesztay, M. ; Telipan, G.

  • Author_Institution
    Petru Poni Inst. of Macromolecular Chem., Iasi
  • Volume
    2
  • fYear
    2007
  • fDate
    Oct. 15 2007-Sept. 17 2007
  • Firstpage
    365
  • Lastpage
    368
  • Abstract
    A series of aromatic polyimides containing pendant hydroxylic groups has been prepared by solution polycondensation reaction of a fluorinated bis(o-aminophenol), namely 2,2-bis(3-amino-4- hydroxyphenyl)hexafluoropropane, with aromatic dianhydrides. All polymers were soluble in polar organic solvents, such as N-methylpyrrolidinone, N,N-dimethylformamide, N,N-dimethylacetamide and methyl-ethyl-ketone, as well as in less polar organic solvents, such as tetrahydrofuran. They were amorphous, as evidenced by DSC analysis, and afforded transparent and flexible films by solution casting onto glass substrates. The polymers showed weight- and number-average molecular weights in the range of 28700-65000 g/mol and 11300-35300 g/mol, respectively. They showed high thermal stability´ with decomposition temperature above 400degC and a glass transition temperature in the range of 250-305degC. Due to these properties the present polymers can be used as materials for advanced applications.
  • Keywords
    amorphous state; casting; condensation; differential scanning calorimetry; glass transition; polymer films; 2,2-bis(3-amino-4- hydroxyphenyl)hexafluoropropane; DSC; N,N-dimethylacetamide; N,N-dimethylformamide; N-methylpyrrolidinone; amorphous solvents; aromatic dianhydrides; aromatic polyimide containing pendant hydroxylic groups; decomposition temperature; fluorinated bis(o-aminophenol); glass substrates; glass transition temperature; hydroxy-functionalized polyimides; methyl-ethyl-ketone; polar organic solvents; solution casting; solution polycondensation reaction; tetrahydrofuran; thermal stability; transparent films; Chemical industry; Glass; Nitrogen; Polyimides; Polymer films; Space heating; Spine; Temperature; Thermal resistance; Thermal stability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Conference, 2007. CAS 2007. International
  • Conference_Location
    Sinaia
  • ISSN
    1545-827X
  • Print_ISBN
    978-1-4244-0847-4
  • Type

    conf

  • DOI
    10.1109/SMICND.2007.4519736
  • Filename
    4519736