DocumentCode :
3439156
Title :
Hydroxy - Functionalized Polyimides as Materials for Advanced Applications
Author :
Hamciuc, E. ; Bruma, M. ; Schulz, B. ; Szesztay, M. ; Telipan, G.
Author_Institution :
Petru Poni Inst. of Macromolecular Chem., Iasi
Volume :
2
fYear :
2007
fDate :
Oct. 15 2007-Sept. 17 2007
Firstpage :
365
Lastpage :
368
Abstract :
A series of aromatic polyimides containing pendant hydroxylic groups has been prepared by solution polycondensation reaction of a fluorinated bis(o-aminophenol), namely 2,2-bis(3-amino-4- hydroxyphenyl)hexafluoropropane, with aromatic dianhydrides. All polymers were soluble in polar organic solvents, such as N-methylpyrrolidinone, N,N-dimethylformamide, N,N-dimethylacetamide and methyl-ethyl-ketone, as well as in less polar organic solvents, such as tetrahydrofuran. They were amorphous, as evidenced by DSC analysis, and afforded transparent and flexible films by solution casting onto glass substrates. The polymers showed weight- and number-average molecular weights in the range of 28700-65000 g/mol and 11300-35300 g/mol, respectively. They showed high thermal stability´ with decomposition temperature above 400degC and a glass transition temperature in the range of 250-305degC. Due to these properties the present polymers can be used as materials for advanced applications.
Keywords :
amorphous state; casting; condensation; differential scanning calorimetry; glass transition; polymer films; 2,2-bis(3-amino-4- hydroxyphenyl)hexafluoropropane; DSC; N,N-dimethylacetamide; N,N-dimethylformamide; N-methylpyrrolidinone; amorphous solvents; aromatic dianhydrides; aromatic polyimide containing pendant hydroxylic groups; decomposition temperature; fluorinated bis(o-aminophenol); glass substrates; glass transition temperature; hydroxy-functionalized polyimides; methyl-ethyl-ketone; polar organic solvents; solution casting; solution polycondensation reaction; tetrahydrofuran; thermal stability; transparent films; Chemical industry; Glass; Nitrogen; Polyimides; Polymer films; Space heating; Spine; Temperature; Thermal resistance; Thermal stability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Conference, 2007. CAS 2007. International
Conference_Location :
Sinaia
ISSN :
1545-827X
Print_ISBN :
978-1-4244-0847-4
Type :
conf
DOI :
10.1109/SMICND.2007.4519736
Filename :
4519736
Link To Document :
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