DocumentCode
3439156
Title
Hydroxy - Functionalized Polyimides as Materials for Advanced Applications
Author
Hamciuc, E. ; Bruma, M. ; Schulz, B. ; Szesztay, M. ; Telipan, G.
Author_Institution
Petru Poni Inst. of Macromolecular Chem., Iasi
Volume
2
fYear
2007
fDate
Oct. 15 2007-Sept. 17 2007
Firstpage
365
Lastpage
368
Abstract
A series of aromatic polyimides containing pendant hydroxylic groups has been prepared by solution polycondensation reaction of a fluorinated bis(o-aminophenol), namely 2,2-bis(3-amino-4- hydroxyphenyl)hexafluoropropane, with aromatic dianhydrides. All polymers were soluble in polar organic solvents, such as N-methylpyrrolidinone, N,N-dimethylformamide, N,N-dimethylacetamide and methyl-ethyl-ketone, as well as in less polar organic solvents, such as tetrahydrofuran. They were amorphous, as evidenced by DSC analysis, and afforded transparent and flexible films by solution casting onto glass substrates. The polymers showed weight- and number-average molecular weights in the range of 28700-65000 g/mol and 11300-35300 g/mol, respectively. They showed high thermal stability´ with decomposition temperature above 400degC and a glass transition temperature in the range of 250-305degC. Due to these properties the present polymers can be used as materials for advanced applications.
Keywords
amorphous state; casting; condensation; differential scanning calorimetry; glass transition; polymer films; 2,2-bis(3-amino-4- hydroxyphenyl)hexafluoropropane; DSC; N,N-dimethylacetamide; N,N-dimethylformamide; N-methylpyrrolidinone; amorphous solvents; aromatic dianhydrides; aromatic polyimide containing pendant hydroxylic groups; decomposition temperature; fluorinated bis(o-aminophenol); glass substrates; glass transition temperature; hydroxy-functionalized polyimides; methyl-ethyl-ketone; polar organic solvents; solution casting; solution polycondensation reaction; tetrahydrofuran; thermal stability; transparent films; Chemical industry; Glass; Nitrogen; Polyimides; Polymer films; Space heating; Spine; Temperature; Thermal resistance; Thermal stability;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Conference, 2007. CAS 2007. International
Conference_Location
Sinaia
ISSN
1545-827X
Print_ISBN
978-1-4244-0847-4
Type
conf
DOI
10.1109/SMICND.2007.4519736
Filename
4519736
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