DocumentCode
3439622
Title
A global chip test implementation including built-in self-test
Author
Erdal, A.C. ; Uszynski, Pierre A.
Author_Institution
Signetics, Sunnyvale, CA, USA
fYear
1988
fDate
3-5 Oct 1988
Firstpage
446
Lastpage
449
Abstract
The authors describe a systematic global test strategy and its implementation into a CMOS VLSI chip. Features include built-in self-test (BIST), embedded scan path, and boundary scan path for chip and board testability and diagnostics. The BIST implementation was derived from the sliding parity response compaction scheme and the boundary scan scheme was developed following the Joint Test Action Group Standard. The BIST method allows a systematic self-test design in a cell-based IC design methodology with a very high fault coverage in a very short test time. Critical parameters such as fault coverage, area overhead, performance degradation, and testing time are also reported
Keywords
CMOS integrated circuits; VLSI; automatic testing; circuit CAD; integrated circuit testing; CMOS VLSI chip; area overhead; boundary scan path; built-in self-test; embedded scan path; fault coverage; global chip test implementation; performance degradation; Automatic testing; Built-in self-test; Circuit testing; Compaction; Flip-flops; Logic testing; Production; Registers; System testing; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Design: VLSI in Computers and Processors, 1988. ICCD '88., Proceedings of the 1988 IEEE International Conference on
Conference_Location
Rye Brook, NY
Print_ISBN
0-8186-0872-2
Type
conf
DOI
10.1109/ICCD.1988.25740
Filename
25740
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