• DocumentCode
    3439622
  • Title

    A global chip test implementation including built-in self-test

  • Author

    Erdal, A.C. ; Uszynski, Pierre A.

  • Author_Institution
    Signetics, Sunnyvale, CA, USA
  • fYear
    1988
  • fDate
    3-5 Oct 1988
  • Firstpage
    446
  • Lastpage
    449
  • Abstract
    The authors describe a systematic global test strategy and its implementation into a CMOS VLSI chip. Features include built-in self-test (BIST), embedded scan path, and boundary scan path for chip and board testability and diagnostics. The BIST implementation was derived from the sliding parity response compaction scheme and the boundary scan scheme was developed following the Joint Test Action Group Standard. The BIST method allows a systematic self-test design in a cell-based IC design methodology with a very high fault coverage in a very short test time. Critical parameters such as fault coverage, area overhead, performance degradation, and testing time are also reported
  • Keywords
    CMOS integrated circuits; VLSI; automatic testing; circuit CAD; integrated circuit testing; CMOS VLSI chip; area overhead; boundary scan path; built-in self-test; embedded scan path; fault coverage; global chip test implementation; performance degradation; Automatic testing; Built-in self-test; Circuit testing; Compaction; Flip-flops; Logic testing; Production; Registers; System testing; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Design: VLSI in Computers and Processors, 1988. ICCD '88., Proceedings of the 1988 IEEE International Conference on
  • Conference_Location
    Rye Brook, NY
  • Print_ISBN
    0-8186-0872-2
  • Type

    conf

  • DOI
    10.1109/ICCD.1988.25740
  • Filename
    25740