DocumentCode :
3439654
Title :
The Voltage Dependence of Reverse Current of Semiconductor PN Junctions and its Distribution over the Device Area
Author :
Obreja, Vasile V N
Author_Institution :
Nat. R&D Inst. for Microtechnol., Bucharest
Volume :
2
fYear :
2007
fDate :
Oct. 15 2007-Sept. 17 2007
Firstpage :
485
Lastpage :
488
Abstract :
Experimental electrical characteristics at room and high temperature are presented for germanium, silicon and silicon carbide PN junction diodes. Linear voltage dependence of reverse current is exhibited for a portion of electrical characteristic if plots in linear-linear scales are considered. At higher applied voltage, deviation from the linear dependence is usually exhibited. In the case of germanium diodes and silicon diodes, existing experimental evidence indicates that such behavior is possible when most of reverse current flows at the junction edge. In the case of silicon carbide PN junctions similar behavior suggests that significant reverse current may flow at the junction edge.
Keywords :
elemental semiconductors; germanium; leakage currents; p-n junctions; semiconductor device breakdown; semiconductor diodes; silicon; silicon compounds; wide band gap semiconductors; Ge; Si; SiC; electrical characteristics; germanium PN junction diodes; linear voltage dependence; linear-linear scales; reverse current; semiconductor PN junctions; silicon PN junction diodes; silicon carbide PN junction diodes; Avalanche breakdown; Breakdown voltage; Electric variables; Germanium; Leakage current; Passivation; Semiconductor diodes; Silicon carbide; Temperature; Virtual reality; PN junction edge; breakdown voltage; electrical characteristic; reverse leakage current;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Conference, 2007. CAS 2007. International
Conference_Location :
Sinaia
ISSN :
1545-827X
Print_ISBN :
978-1-4244-0847-4
Type :
conf
DOI :
10.1109/SMICND.2007.4519766
Filename :
4519766
Link To Document :
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