DocumentCode :
3439684
Title :
Notice of Retraction
The failure mode and mechanism analysis of filament in heater of traveling wave tube
Author :
Fangfang Song ; Xiaoqi He ; Yunfei En
Author_Institution :
Sci. & Technol. on Reliability Phys. & Applic. of Electron. Component Lab., China Electron. Product Reliability, Guangzhou, China
fYear :
2013
fDate :
15-18 July 2013
Firstpage :
1168
Lastpage :
1171
Abstract :
Notice of Retraction

After careful and considered review of the content of this paper by a duly constituted expert committee, this paper has been found to be in violation of IEEE´s Publication Principles.

We hereby retract the content of this paper. Reasonable effort should be made to remove all past references to this paper.

The presenting author of this paper has the option to appeal this decision by contacting TPII@ieee.org.

Traveling wave tube (TWT) is a type of microwave vacuum electronic component. TWT often works under harsh mechanical environment stress, such as vibration, shock. The stress leads to the open circuit of filament in heater, which results in the change of inner structure and electric performances, even failure. This paper introduced a failure case of TWT in use. Failure mode and failure mechanism of filament in heater of a typical TWT was analyzed in this paper.
Keywords :
failure analysis; travelling wave tubes; TWT; failure mechanism analysis; failure mode; filament; heater; mechanical environment stress; microwave vacuum electronic component; open circuit; traveling wave tube; Electron tubes; Electronic components; Failure analysis; Heating; Reliability; Stress; Vibrations; electronic vaccum rube; failure analysis; failure mechanism; failure mode; heater; traveling microwave tube (TWT);
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE), 2013 International Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4799-1014-4
Type :
conf
DOI :
10.1109/QR2MSE.2013.6625775
Filename :
6625775
Link To Document :
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