Very high speed integrated circuits for optical communication

Author

Konczykowska, A. ; Meghelli, M.

Author_Institution

France Telecom, CNET, Bagneux, France

Volume

3

fYear

1998

fDate

1998

Firstpage

189

Abstract

In this paper ETDM optical communication systems and their main components are discussed. Specific methodology and adequate CAD tools necessary for VHSICs design are presented. Special attention is paid to such design aspects as circuit and layout optimisation, packaging issues, and availability of necessary models. A set of circuits realised in InP DHBT technology for 40 Gb/s optical transmission illustrates the design methodology

Keywords

bipolar integrated circuits; circuit CAD; circuit optimisation; integrated circuit design; integrated circuit layout; integrated circuit modelling; integrated circuit packaging; optical communication equipment; time division multiplexing; very high speed integrated circuits; 40 Gbit/s; CAD tools; ETDM optical communication systems; InP; InP DHBT technology; VHSIC design; circuit optimisation; design methodology; layout optimisation; model availability; optical transmission; packaging issues; very high speed integrated circuits; Availability; DH-HEMTs; Design automation; Design methodology; Design optimization; High speed optical techniques; Indium phosphide; Integrated circuit packaging; Optical fiber communication; Very high speed integrated circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics, Circuits and Systems, 1998 IEEE International Conference on

Conference_Location

Lisboa

Print_ISBN

0-7803-5008-1

Type

conf

DOI

10.1109/ICECS.1998.813964

Filename

813964