DocumentCode
3439828
Title
Analysis of ground bond wire arrays for RFICs
Author
Patterson, H.
Author_Institution
Motorola Inc., Tempe, AZ, USA
Volume
2
fYear
1997
fDate
8-13 June 1997
Firstpage
765
Abstract
This paper outlines a method for rapid computation of the inductance of arrays of ground bond wires for RFICs, thus saving a designer considerable time over using inaccurate empirical equations or slowly converging electromagnetic simulators. Results comparable in accuracy to a fully derailed PEEC electromagnetic simulation are shown.
Keywords
UHF integrated circuits; inductance; integrated circuit packaging; lead bonding; RFIC; ground bond wire arrays; inductance computation; Bonding; Circuit simulation; Computational modeling; Electromagnetic induction; Equations; Geometry; Inductance; Packaging; Radiofrequency integrated circuits; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1997., IEEE MTT-S International
Conference_Location
Denver, CO, USA
ISSN
0149-645X
Print_ISBN
0-7803-3814-6
Type
conf
DOI
10.1109/MWSYM.1997.602902
Filename
602902
Link To Document