DocumentCode :
3440459
Title :
Advanced MOSFETs using HfTaON/SiO/sub 2/ gate dielectric and TaN metal gate with excellent performances for low standby power application
Author :
Yu, Xiongfei ; Zhu, Chunxiang ; Yu, Mingbin ; Li, M.F. ; Chin, Albert ; Tung, C.H. ; Gui, D. ; Kwong, Dim-Lee
Author_Institution :
Dept. of ECE, Singapore Nat. Univ.
fYear :
2005
fDate :
5-5 Dec. 2005
Firstpage :
27
Lastpage :
30
Abstract :
In this work, a novel HfTaON/SiO2 gate dielectric with metal gate has been investigated for low standby power CMOS application. This gate stack exhibits excellent electrical performances, including low leakage current relative to Hf-silicates, good thermal stability, very low interface state density, superior electron and hole mobilities (100% and 96% of universal curves at 0.8 MV/cm), and excellent BTI characteristic. Therefore, the HfTaON/SiO2 has a potential to replace current SiO2 and SiON as the gate dielectric for advanced low standby power application
Keywords :
MOSFET; dielectric thin films; electron mobility; hafnium compounds; hole mobility; silicon compounds; tantalum compounds; thermal stability; BTI characteristic; HfTaON-SiO2; MOSFET device; TaN; electron mobility; gate dielectrics; hole mobility; low interface state density; low leakage current; low standby power CMOS application; metal gate; thermal stability; Annealing; Buffer layers; Degradation; Dielectric materials; Dielectric substrates; Dry etching; Hafnium; Leakage current; MOSFETs; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 2005. IEDM Technical Digest. IEEE International
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-9268-X
Type :
conf
DOI :
10.1109/IEDM.2005.1609257
Filename :
1609257
Link To Document :
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