• DocumentCode
    3441006
  • Title

    A Theoretical Study of the Influence of Gas Pump Thermocouple Hot Cover Structure on Temperature Measurement

  • Author

    Zhang Zhen Gang ; Feng Qing ; Wang Lang

  • Author_Institution
    Jingdezhen Ceramic Inst., Jingdezhen, China
  • fYear
    2013
  • fDate
    3-4 Dec. 2013
  • Firstpage
    153
  • Lastpage
    157
  • Abstract
    Gas pump thermocouple plays a major role in accurate measurement of the kiln temperature and reducing temperature measurement error. How to design and optimize hot cover structure as well as raise temperature measurement precision has become an important issue in researching and developing new temperature measuring equipment. The author uses the FLUENT6.0 software to simulate the suction of thermocouple working status. In view of the thermocouple hot cover structure, three modes are structurally optimized and simulated, namely diffuser nozzle, extended length and narrow hot cover diameter. Contrast temperature of convective data shows that optimizing heat expiation cover structure can reduce temperature measuring error, which provides numerical and theoretical reference for theoretical analysis and making of the equipment.
  • Keywords
    convection; kilns; mechanical engineering computing; nozzles; pumps; research and development; temperature measurement; thermocouples; FLUENT6.0 software; contrast temperature; convective data; gas pump thermocouple hot cover structure; heat expiation cover structure; kiln temperature; nozzle; numerical reference; research and development; temperature measurement; temperature measuring equipment; temperature measuring error; theoretical analysis; theoretical study; thermocouple hot cover structure; Electron tubes; Heat pumps; Heat transfer; Heating; Kilns; Measurement uncertainty; Temperature measurement; gas pump thermocouple; simulation; structure optimization; temperature measurement error;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Software Engineering (WCSE), 2013 Fourth World Congress on
  • Conference_Location
    Hong Kong
  • Print_ISBN
    978-1-4799-2882-8
  • Type

    conf

  • DOI
    10.1109/WCSE.2013.28
  • Filename
    6754278