DocumentCode :
3441328
Title :
High density silicon nanocrystal embedded in sin prepared by low energy (<500eV) SiH/sub 4/ plasma immersion ion implantation for non-volatile memory applications
Author :
Choi, Sangmoo ; Choi, Hyejung ; Kim, Tae-Wook ; Yang, Hyundeok ; Lee, Takhee ; Jeon, Sanghun ; Kim, Chungwoo ; Hwang, Hyunsang
Author_Institution :
Dept. of Mater. Sci. & Eng., Gwangju Inst. of Sci. & Technol.
fYear :
2005
fDate :
5-5 Dec. 2005
Firstpage :
166
Lastpage :
169
Abstract :
We report on the excellent memory properties of silicon nanocrystals (Si-NCs) embedded in SiN. Si-NCs were formed by SiH4 low-energy plasma immersion ion implantation. Compared with control Si+-implanted sample, additional hydrogen enhanced Si-NC density. By incorporating Si-NCs in SiN, improved program/erase efficiency, endurance and retention characteristics were observed due to the generation of additional accessible deep charge traps. Using conductive atomic force microscopy and MIS device with gate area of 100 nm, charge trapping/detrapping and multi-level charge storage of single Si-NC at room temperature were observed
Keywords :
MIS devices; atomic force microscopy; memory architecture; nanostructured materials; plasma immersion ion implantation; silicon compounds; 100 nm; MIS device; SiH4; SiN; atomic force microscopy; charge traps; high density silicon nanocrystal; multi level charge storage; non volatile memory applications; plasma immersion ion implantation; program/erase efficiency; Annealing; Atomic force microscopy; Hydrogen; MIS devices; Materials science and technology; Nanocrystals; Nonvolatile memory; Plasma immersion ion implantation; Silicon compounds; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 2005. IEDM Technical Digest. IEEE International
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-9268-X
Type :
conf
DOI :
10.1109/IEDM.2005.1609296
Filename :
1609296
Link To Document :
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