• DocumentCode
    3441790
  • Title

    Electro-thermal transport in metallic single-wall carbon nanotubes for interconnect applications

  • Author

    Pop, Eric ; Mann, David ; Reifenberg, John ; Goodson, Kenneth ; Dai, Hongjie

  • Author_Institution
    Lab. for Adv. Mater., Stanford Univ., CA
  • fYear
    2005
  • fDate
    5-5 Dec. 2005
  • Lastpage
    256
  • Abstract
    This work represents the first electro-thermal study of metallic single-wall carbon nanotubes (SWNTs) for interconnect applications. Experimental data and careful modeling reveal that self-heating is of significance in short (1 < L < 10 mum) nanotubes under high-bias. The low-bias resistance of micron scale SWNTs is also found to be affected by optical phonon absorption (a scattering mechanism previously neglected) above 250 K. We also explore length-dependent electrical breakdown of SWNTs in ambient air. Significant self-heating in SWNT interconnects can be avoided if power densities per unit length are limited to less than 5 muW/mum
  • Keywords
    S-parameters; carbon nanotubes; electric breakdown; integrated circuit interconnections; 250 K; electrical breakdown; electro thermal transport; interconnect applications; low bias resistance; optical phonon absorption; power densities; scattering mechanism; self heating; single wall carbon nanotubes; Absorption; Acoustic scattering; Carbon nanotubes; Electric resistance; Integrated circuit interconnections; Optical scattering; Phonons; Temperature; Thermal conductivity; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2005. IEDM Technical Digest. IEEE International
  • Conference_Location
    Washington, DC
  • Print_ISBN
    0-7803-9268-X
  • Type

    conf

  • DOI
    10.1109/IEDM.2005.1609321
  • Filename
    1609321