DocumentCode :
3441834
Title :
Wrap-gated inas nanowire field-effect transistor
Author :
Wernersson, Lars-Erik ; Bryllert, Tomas ; Lind, Erik ; Samuelson, Lars
Author_Institution :
Dept. of Solid State Phys., Lund Univ.
fYear :
2005
fDate :
5-5 Dec. 2005
Firstpage :
265
Lastpage :
268
Abstract :
Field-effect transistors (FETs) based on semiconductor nanowires (Bryllert et al., 2005) have the potential to improve certain aspects of existing planar FET technologies. The possibility to form wrap-gates gives an efficient gate coupling resulting in reduced drain-induced barrier lowering. Furthermore, lateral strain relaxation allows a new freedom in combining materials in heterostructures, where materials with different lattice constants can be combined without defects (Bjork et al., 2002). Since the transistor channel, unlike the planar FETs, is vertical, heterostructures may be used to tailor the bandstructure along the direction of current flow. In this paper, we demonstrate a new technology to fabricate vertical nanowire FETs in a process that almost exclusively relies on optical lithography and standard III-V processing techniques. We measure encouraging electrical data, including current saturation at Vds equiv 0.15 V (for Vg equiv 0 V) and low voltage operation Vth equiv -0.15 V, and present opportunities to improve the device performance by heterostructure design
Keywords :
III-V semiconductors; field effect transistors; indium compounds; low-power electronics; nanowires; photolithography; 0.15 V; InAs; drain induced barrier lowering; field effect transistor; gate coupling; heterostructures design; lateral strain relaxation; lattice constants; optical lithography; semiconductor nanowires; wrap gated nanowire; Capacitive sensors; Current measurement; Electric variables measurement; FETs; III-V semiconductor materials; Lattices; Lithography; Low voltage; Optical saturation; Semiconductor materials;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 2005. IEDM Technical Digest. IEEE International
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-9268-X
Type :
conf
DOI :
10.1109/IEDM.2005.1609324
Filename :
1609324
Link To Document :
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