DocumentCode :
3441853
Title :
Incorporating multi-chip module packaging constraints into system design
Author :
Garg, Vivek ; Lacy, Steve ; Schimmel, David E. ; Stogner, D. ; Ulmer, Craig ; Wills, Scott D. ; Yalamanchili, Sudhakar
Author_Institution :
Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
fYear :
1996
fDate :
11-14 Mar 1996
Firstpage :
508
Lastpage :
513
Abstract :
Computer system design addresses the optimization of metrics such as cost, performance, power, and reliability in the presence of physical constraints. The advent of large area, low cost Multi-Chip Modules (MCM) will lead to a new class of optimal system designs. This paper explores the early analysis of the impact of packaging technology on this design process. Our goal is to develop a suite of tools to evaluate computing system architectures under the constraints of various technologies. The design of the memory hierarchy in high speed microprocessors is used to explore the nature and type of trade-offs that can be made during the conceptual design of computing systems
Keywords :
computer architecture; design engineering; memory architecture; microprocessor chips; multichip modules; computer system design; high speed microprocessor; memory hierarchy; multi-chip module packaging; optimization; Computer architecture; Constraint optimization; Cost function; Design optimization; Microprocessors; Packaging; Physics computing; Power system reliability; Process design; System analysis and design;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
European Design and Test Conference, 1996. ED&TC 96. Proceedings
Conference_Location :
Paris
ISSN :
1066-1409
Print_ISBN :
0-8186-7424-5
Type :
conf
DOI :
10.1109/EDTC.1996.494348
Filename :
494348
Link To Document :
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