Title :
Local-damascene-finFET DRAM integration with p/sup +/ doped poly-silicon gate technology for sub-60nm device generations
Author :
Kim, Yong-Sung ; Lee, Sang-Hyeon ; Shin, Soo-Ho ; Han, Sung-Hee ; Lee, Ju-Yong ; Lee, Jin-Woo ; Han, Jun ; Yang, Seung-Chul ; Sung, Joon-Ho ; Lee, Eun-Cheol ; Song, Bo-Young ; Lee, Dong-Jun ; Bae, Dong-Il ; Yang, Won-Suk ; Park, Yang-Keun ; Lee, Kyu-Hyun
Author_Institution :
Adv. Technol. Dev., Samsung Electron. Co. Ltd., Gyunggi-Do
Abstract :
We integrate FinFET DRAM in sub-60nm feature size. To avoid severe passing gate effects in FinFET cell array, we introduce a local damascene gate structure. Threshold voltage control of the ultra thin body transistors is successfully achieved by adopting p+ boron in-situ doped poly-silicon gate on the FinFET cells. As a result, very stable and uniform operation of FinFET cells is realized. The local damascene FinFET with p+ gate can become a highly feasible mainstream DRAM technology for sub-60nm low-power high-speed devices
Keywords :
DRAM chips; MOSFET; boron; elemental semiconductors; low-power electronics; semiconductor doping; silicon; 60 nm; DRAM; Si:B; finFET; local damascene gate structure; polysilicon gate technology; threshold voltage control; ultra thin body transistors; Boron; Doping; Etching; FinFETs; Leakage current; Low voltage; Random access memory; Threshold voltage; Transistors; Voltage control;
Conference_Titel :
Electron Devices Meeting, 2005. IEDM Technical Digest. IEEE International
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-9268-X
DOI :
10.1109/IEDM.2005.1609338