• DocumentCode
    3442106
  • Title

    Local-damascene-finFET DRAM integration with p/sup +/ doped poly-silicon gate technology for sub-60nm device generations

  • Author

    Kim, Yong-Sung ; Lee, Sang-Hyeon ; Shin, Soo-Ho ; Han, Sung-Hee ; Lee, Ju-Yong ; Lee, Jin-Woo ; Han, Jun ; Yang, Seung-Chul ; Sung, Joon-Ho ; Lee, Eun-Cheol ; Song, Bo-Young ; Lee, Dong-Jun ; Bae, Dong-Il ; Yang, Won-Suk ; Park, Yang-Keun ; Lee, Kyu-Hyun

  • Author_Institution
    Adv. Technol. Dev., Samsung Electron. Co. Ltd., Gyunggi-Do
  • fYear
    2005
  • fDate
    5-5 Dec. 2005
  • Firstpage
    315
  • Lastpage
    318
  • Abstract
    We integrate FinFET DRAM in sub-60nm feature size. To avoid severe passing gate effects in FinFET cell array, we introduce a local damascene gate structure. Threshold voltage control of the ultra thin body transistors is successfully achieved by adopting p+ boron in-situ doped poly-silicon gate on the FinFET cells. As a result, very stable and uniform operation of FinFET cells is realized. The local damascene FinFET with p+ gate can become a highly feasible mainstream DRAM technology for sub-60nm low-power high-speed devices
  • Keywords
    DRAM chips; MOSFET; boron; elemental semiconductors; low-power electronics; semiconductor doping; silicon; 60 nm; DRAM; Si:B; finFET; local damascene gate structure; polysilicon gate technology; threshold voltage control; ultra thin body transistors; Boron; Doping; Etching; FinFETs; Leakage current; Low voltage; Random access memory; Threshold voltage; Transistors; Voltage control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2005. IEDM Technical Digest. IEEE International
  • Conference_Location
    Washington, DC
  • Print_ISBN
    0-7803-9268-X
  • Type

    conf

  • DOI
    10.1109/IEDM.2005.1609338
  • Filename
    1609338