Title :
An opto-electronic multi-chip module for chip-scale interconnects
Author :
Prather, D.W. ; Venkataraman, S. ; LeCompte, M.R. ; Campos, B. ; Kiamilev, F. ; Mait, J.N. ; Simonis, G.J.
Author_Institution :
Dept. of Electr. & Comput. Eng., Delaware Univ., Newark, DE, USA
Abstract :
Summary form only given. We have demonstrated an integrated optoelectronic MCM that uses a glass substrate as a mechanical carrier for the VCSEL, VCSEL driver, and diffractive element. Over a distance a little longer than 1 mm, our system fanned-out a single VCSEL into 60 individual fan-outs.
Keywords :
chip scale packaging; diffractive optical elements; driver circuits; multichip modules; optical interconnections; semiconductor lasers; surface emitting lasers; 1 mm; VCSEL driver; chip-scale interconnects; diffractive element; fanned-out; glass substrate; individual fan-outs; integrated optoelectronic MCM; mechanical carrier; opto-electronic multi-chip module; single VCSEL; Ceramics; Fiber lasers; Integrated circuit interconnections; Laser modes; Optical receivers; Optical transmitters; Robots; Silicon; Transceivers; Wavelength division multiplexing;
Conference_Titel :
Lasers and Electro-Optics, 2001. CLEO '01. Technical Digest. Summaries of papers presented at the Conference on
Conference_Location :
Baltimore, MD, USA
Print_ISBN :
1-55752-662-1
DOI :
10.1109/CLEO.2001.947436
