• DocumentCode
    3443396
  • Title

    High power SiC modules for HEVs and PHEVs

  • Author

    Chinthavali, M. ; Tolbert, L.M. ; Zhang, H. ; Han, J.H. ; Barlow, F. ; Ozpineci, B.

  • Author_Institution
    Power Electron. & Electr. Machinery Res. Center, Oak Ridge Nat. Lab., Knoxville, TN, USA
  • fYear
    2010
  • fDate
    21-24 June 2010
  • Firstpage
    1842
  • Lastpage
    1848
  • Abstract
    With efforts to reduce the cost, size, and thermal management systems for the power electronics drivetrain in hybrid electric vehicles (HEVs) and plug-in hybrid electric vehicles (PHEVs), wide band gap semiconductors including silicon carbide (SiC) have been identified as possibly being a partial solution. Research on SiC power electronics has shown their higher efficiency compared to Si power electronics due to significantly lower conduction and switching losses. This paper focuses on the development of a high power module based on SiC JFETs and Schottky diodes. Characterization of a single device, a module developed using the same device, and finally an inverter built using the modules is presented. When tested at moderate load levels compared to the inverter rating, an efficiency of 98.2% was achieved by the initial prototype.
  • Keywords
    Schottky diodes; hybrid electric vehicles; invertors; junction gate field effect transistors; power electronics; silicon compounds; thermal management (packaging); wide band gap semiconductors; JFET; Schottky diodes; SiC; inverter rating; load level; plug-in hybrid electric vehicles; power electronics; switching losses; thermal management systems; Costs; Energy management; Hybrid electric vehicles; Inverters; Power electronics; Power system management; Silicon carbide; Thermal management; Thermal management of electronics; Wide band gap semiconductors; HEV; JFET; PHEV; Silicon Carbide; efficiency; hybrid electric vehicle; inverter;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics Conference (IPEC), 2010 International
  • Conference_Location
    Sapporo
  • Print_ISBN
    978-1-4244-5394-8
  • Type

    conf

  • DOI
    10.1109/IPEC.2010.5542158
  • Filename
    5542158