Title :
BE-SONOS: A bandgap engineered SONOS with excellent performance and reliability
Author :
Lue, Hang-Ting ; Wang, Szu-Yu ; Lai, Erh-Kun ; Shih, Yen-Hao ; Lai, Sheng-Chih ; Yang, Ling-Wu ; Chen, Kuang-Chao ; Ku, Joseph ; Hsieh, Kuang-Yeu ; Liu, Rich ; Lu, Chih-Yuan
Author_Institution :
Emerging Central Lab., Macronix Int. Co. Ltd., Hsinchu
Abstract :
A bandgap engineered SONOS with greatly improved reliability properties is proposed. This concept is demonstrated by a multilayer structure of O1/N1/O2/N2/O3, where the ultra-thin "O1/N1/O2" serves as a non-trapping tunneling dielectric, N2 the high-trapping-rate charge storage layer, and O3 the blocking oxide. The ultra-thin "O1/N1/O2" provides a "modulated tunneling barrier" - it suppresses direct tunneling at low electric field during retention, while it allows efficient hole tunneling erase at high electric field due to the band offset. Therefore, this BE-SONOS offers fast hole tunneling erase, while it is immune to the retention problem of the conventional SONOS. With a N+-poly gate, we achieve self-convergent erased Vt ~3 V, suitable for NOR flash application. On the other hand, by using a P+-poly gate, a depletion mode device (Vt < 0) is obtained, and a very large memory window (> 6 V) is achieved, ideal for MLC-NAND application. Excellent performance and reliability for both applications are demonstrated. Furthermore, with this simple structure and no new materials BE-SONOS is readily manufacturable
Keywords :
NOR circuits; circuit reliability; energy gap; flash memories; logic gates; silicon compounds; tunnelling; BE-SONOS; MLC-NAND application; NOR flash; bandgap engineered SONOS; blocking oxide; charge storage layer; depletion mode device; electric field; hole tunneling erase; modulated tunneling barrier; multilayer structure; nontrapping tunneling dielectric; reliability properties; Capacitors; Dielectrics; Hot carriers; MOSFET circuits; Nonhomogeneous media; Nonvolatile memory; Photonic band gap; Reliability engineering; SONOS devices; Tunneling;
Conference_Titel :
Electron Devices Meeting, 2005. IEDM Technical Digest. IEEE International
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-9268-X
DOI :
10.1109/IEDM.2005.1609404