• DocumentCode
    3443578
  • Title

    An over 100 W n-GaN/n-AlGaN/GaN MIS-HEMT power amplifier for wireless base station applications

  • Author

    Kanamura, M. ; Kikkawa, T. ; Iwai, T. ; Imanishi, K. ; Kubo, T. ; Joshin, K.

  • Author_Institution
    Fujitsu Labs. Ltd., Atsugi
  • fYear
    2005
  • fDate
    5-5 Dec. 2005
  • Firstpage
    572
  • Lastpage
    575
  • Abstract
    Novel n-GaN/n-AlGaN/GaN metal-insulator-semiconductor high electron mobility transistors (MIS-HEMTs) with Si3N4 film were fabricated on a semi-insulating (S.I.) SiC substrate. An n-GaN/n-AlGaN/GaN MIS-HEMT with a breakdown voltage of 400 V was obtained by using SiN/n-GaN cap structure. The single-chip GaN MIS-HEMT amplifier operated at 60 V achieves a high output power of 110 W with a linear gain of 13 dB at 2.14 GHz. This is the first report of an AlGaN/GaN MIS-HEMT with an over 100 W output power. The MIS-HEMT amplifier, combined with a digital pre-distortion (DPD) system, also demonstrates an adjacent channel leakage power ratio (ACLR) of less than -50 dBc for 4-carrier W-CDMA signals
  • Keywords
    III-V semiconductors; MIS devices; UHF power amplifiers; aluminium compounds; code division multiple access; distortion; gallium compounds; power HEMT; semiconductor device breakdown; silicon compounds; 110 W; 13 dB; 2.14 GHz; 400 V; 60 V; ACLR; DPD system; GaN-AlGaN-GaN; MIS-HEMT power amplifier; Si3N4; SiC; SiN-GaN; W-CDMA signals; adjacent channel leakage power ratio; breakdown voltage; digital pre-distortion system; metal-insulator-semiconductor high electron mobility transistors; semi-insulating substrate; wireless base station; Base stations; Gallium nitride; HEMTs; MODFETs; Metal-insulator structures; Power amplifiers; Power generation; Semiconductor films; Silicon carbide; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2005. IEDM Technical Digest. IEEE International
  • Conference_Location
    Washington, DC
  • Print_ISBN
    0-7803-9268-X
  • Type

    conf

  • DOI
    10.1109/IEDM.2005.1609411
  • Filename
    1609411