DocumentCode
3443578
Title
An over 100 W n-GaN/n-AlGaN/GaN MIS-HEMT power amplifier for wireless base station applications
Author
Kanamura, M. ; Kikkawa, T. ; Iwai, T. ; Imanishi, K. ; Kubo, T. ; Joshin, K.
Author_Institution
Fujitsu Labs. Ltd., Atsugi
fYear
2005
fDate
5-5 Dec. 2005
Firstpage
572
Lastpage
575
Abstract
Novel n-GaN/n-AlGaN/GaN metal-insulator-semiconductor high electron mobility transistors (MIS-HEMTs) with Si3N4 film were fabricated on a semi-insulating (S.I.) SiC substrate. An n-GaN/n-AlGaN/GaN MIS-HEMT with a breakdown voltage of 400 V was obtained by using SiN/n-GaN cap structure. The single-chip GaN MIS-HEMT amplifier operated at 60 V achieves a high output power of 110 W with a linear gain of 13 dB at 2.14 GHz. This is the first report of an AlGaN/GaN MIS-HEMT with an over 100 W output power. The MIS-HEMT amplifier, combined with a digital pre-distortion (DPD) system, also demonstrates an adjacent channel leakage power ratio (ACLR) of less than -50 dBc for 4-carrier W-CDMA signals
Keywords
III-V semiconductors; MIS devices; UHF power amplifiers; aluminium compounds; code division multiple access; distortion; gallium compounds; power HEMT; semiconductor device breakdown; silicon compounds; 110 W; 13 dB; 2.14 GHz; 400 V; 60 V; ACLR; DPD system; GaN-AlGaN-GaN; MIS-HEMT power amplifier; Si3N4; SiC; SiN-GaN; W-CDMA signals; adjacent channel leakage power ratio; breakdown voltage; digital pre-distortion system; metal-insulator-semiconductor high electron mobility transistors; semi-insulating substrate; wireless base station; Base stations; Gallium nitride; HEMTs; MODFETs; Metal-insulator structures; Power amplifiers; Power generation; Semiconductor films; Silicon carbide; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 2005. IEDM Technical Digest. IEEE International
Conference_Location
Washington, DC
Print_ISBN
0-7803-9268-X
Type
conf
DOI
10.1109/IEDM.2005.1609411
Filename
1609411
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