Title :
Erratic fluctuations of sram cache vmin at the 90nm process technology node
Author :
Agostinelli, M. ; Hicks, J. ; Xu, J. ; Woolery, B. ; Mistry, K. ; Zhang, K. ; Jacobs, S. ; Jopling, J. ; Yang, W. ; Lee, B. ; Raz, T. ; Mehalel, M. ; Kolar, P. ; Wang, Y. ; Sandford, J. ; Pivin, D. ; Peterson, C. ; DiBattista, M. ; Pae, S. ; Jones, M. ; J
Author_Institution :
Logic TD Q&R, Intel Corp., Hillsboro, OR
Abstract :
Erratic bit phenomena have been reported in advanced flash memories, and have been attributed to trapping/detrapping effects that modify the threshold voltage. This paper describes for the first time the observance of erratic behavior in SRAM Vmin, defined as the minimum voltage at which the SRAM array is functional. Random telegraph signal (RTS) noise in the soft breakdown gate leakage is shown to be the cause. The erratic Vmin phenomenon can be eliminated for 90 nm SRAMs by process optimization. However, erratic Vmin behavior gets worse with smaller cell sizes and represents another constraint on the scaling of SRAM cells and on the minimum operating voltage of the SRAM array. A combination of process and circuit solutions will likely be needed to enable continued SRAM cell scaling
Keywords :
SRAM chips; electron traps; flash memories; integrated circuit noise; 90 nm; RTS noise; SRAM array; SRAM cache; SRAM cell scaling; advanced flash memories; erratic bit phenomena; erratic fluctuations; nanotechnology node; process optimization; random telegraph signal noise; soft breakdown gate leakage; trapping/detrapping effects; Electric breakdown; Electron traps; Flash memory; Fluctuations; Jacobian matrices; Logic arrays; Probability distribution; Random access memory; Sampling methods; Threshold voltage;
Conference_Titel :
Electron Devices Meeting, 2005. IEDM Technical Digest. IEEE International
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-9268-X
DOI :
10.1109/IEDM.2005.1609436