Performance and yield calculations for large-area thin-film modules through distributed modeling

A modeling methodology based on an accurate distributed SPICE model is developed to analyze the impact of non-uniformity on the performance of large-area thin-film modules. The simulation quantifies the losses due to spatial variations in process, using an assumed thickness distribution across the module. The analysis of local operating points elucidates the ability of the circuit to adapt voltage and current distributions in order to minimize the impact of non-uniformity. The simulation method is also used to investigate yield issues such as the yield loss through defect shunts.