• DocumentCode
    3444849
  • Title

    Ge-spacer technology in AlGaN/GaN HEMTs for mm-wave applications

  • Author

    Palacios, T. ; Snow, E. ; Pei, Y. ; Chakraborty, A. ; Keller, S. ; DenBaars, S.P. ; Mishra, U.K.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA
  • fYear
    2005
  • fDate
    5-5 Dec. 2005
  • Lastpage
    789
  • Abstract
    GaN-based high electron mobility transistors (HEMTs) are the most promising option for power amplification at frequencies above 30 GHz. However, the difficult technology of nitride devices has hindered the aggressive scaling of these transistors needed for high frequency applications. Also, the need of a relatively thick passivation layer to avoid current collapse in these transistors has significantly limited the high frequency performance of the devices. In this paper, we introduces an advanced technology which uses a Ge sacrificial layer to fabricate passivated AlGaN/GaN HEMTs with gate lengths down to 90 nm, while maintaining a high breakdown voltage and minimum parasitic capacitances. Using these devices, we demonstrate record high frequency performance at both small and large signal levels
  • Keywords
    III-VI semiconductors; aluminium compounds; gallium compounds; germanium; millimetre wave power amplifiers; passivation; power HEMT; wide band gap semiconductors; 90 nm; AlGaN-GaN-Ge; HEMT; advanced technology; current collapse; passivation layer; power amplification; sacrificial layer; spacer technology; Aluminum gallium nitride; Application software; Dry etching; Frequency; Gallium nitride; HEMTs; Lithography; MODFETs; Parasitic capacitance; Passivation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2005. IEDM Technical Digest. IEEE International
  • Conference_Location
    Washington, DC
  • Print_ISBN
    0-7803-9268-X
  • Type

    conf

  • DOI
    10.1109/IEDM.2005.1609472
  • Filename
    1609472