DocumentCode
3444849
Title
Ge-spacer technology in AlGaN/GaN HEMTs for mm-wave applications
Author
Palacios, T. ; Snow, E. ; Pei, Y. ; Chakraborty, A. ; Keller, S. ; DenBaars, S.P. ; Mishra, U.K.
Author_Institution
Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA
fYear
2005
fDate
5-5 Dec. 2005
Lastpage
789
Abstract
GaN-based high electron mobility transistors (HEMTs) are the most promising option for power amplification at frequencies above 30 GHz. However, the difficult technology of nitride devices has hindered the aggressive scaling of these transistors needed for high frequency applications. Also, the need of a relatively thick passivation layer to avoid current collapse in these transistors has significantly limited the high frequency performance of the devices. In this paper, we introduces an advanced technology which uses a Ge sacrificial layer to fabricate passivated AlGaN/GaN HEMTs with gate lengths down to 90 nm, while maintaining a high breakdown voltage and minimum parasitic capacitances. Using these devices, we demonstrate record high frequency performance at both small and large signal levels
Keywords
III-VI semiconductors; aluminium compounds; gallium compounds; germanium; millimetre wave power amplifiers; passivation; power HEMT; wide band gap semiconductors; 90 nm; AlGaN-GaN-Ge; HEMT; advanced technology; current collapse; passivation layer; power amplification; sacrificial layer; spacer technology; Aluminum gallium nitride; Application software; Dry etching; Frequency; Gallium nitride; HEMTs; Lithography; MODFETs; Parasitic capacitance; Passivation;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 2005. IEDM Technical Digest. IEEE International
Conference_Location
Washington, DC
Print_ISBN
0-7803-9268-X
Type
conf
DOI
10.1109/IEDM.2005.1609472
Filename
1609472
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