Title :
Development of low loss organic-micromachined interconnects on silicon at microwave frequencies
Author :
Newlin, D. ; Pham, A. ; Harris, J. ; Lee, J.-B.
Author_Institution :
Dept. of Electr. & Comput. Eng., Clemson Univ., SC, USA
Abstract :
We present the design and development of organic micromachined structures on silicon (Si) at microwave/millimeter wave frequencies. The process employs an ultra-thick negative photoresist SU-8 that can be spun-coated and processed using standard lithography techniques. Using this process, we develop micromachined coplanar waveguide (CPW) interconnects on Si substrates. The micromachined grounded-CPW on Si (7.2 Ω-cm) achieves a measured insertion loss of 0.07 dB/mm and 0. 13 dB/mm at 10 GHz and 20 GHz, respectively
Keywords :
coplanar waveguides; integrated circuit interconnections; integrated circuit packaging; micromachining; photolithography; silicon; 10 GHz; 20 GHz; CPW interconnects; SU-8 negative photoresist; Si; insertion loss; lithography; low loss organic-micromachined interconnects; micromachined coplanar waveguide; micromachined grounded-CPW; microwave frequencies; millimeter wave frequencies; silicon; Coplanar waveguides; Insertion loss; Integrated circuit interconnections; Lithography; Loss measurement; Microwave frequencies; Millimeter wave technology; Polymers; Resists; Silicon;
Conference_Titel :
Radio and Wireless Conference, 2001. RAWCON 2001. IEEE
Conference_Location :
Waltham, MA
Print_ISBN :
0-7803-7189-5
DOI :
10.1109/RAWCON.2001.947597
