DocumentCode :
3445601
Title :
Solder bond applications in a piezoelectric sensor assembly
Author :
Vianco, Paul T. ; Rejent, Jerome A.
Author_Institution :
Sandia Nat. Lab., Albuquerque, NM, USA
fYear :
1991
fDate :
29-31 May 1991
Firstpage :
266
Lastpage :
280
Abstract :
A procedure to use solder technology in the assembly of a single-crystal quartz accelerometer was developed. 87.5 Au-12.5 Ge (wt.%) solder films 0.5×10-6, 1.0×1.0-6, and 2.0×10-6 m thick were formed by the electron beam deposition of individual layers of Au and Ge with thicknesses so that the bulk film composition equaled the eutectic composition. The 2.0×10-6 m thick quartz/Au-Ge/quartz bonds had an adhesive tensile strength of 17±2 MPa. The strength increased to 29±3 MPa and 27±12 MPa after thermal shock and thermal cycle exposures, respectively. The 1.0×10-6 m thick bonds exhibited strengths of 16±3 MPa, and 15±8 MPa in the as-fabricated, post-thermal shock, and post-thermal cycled samples, respectively. The 0.5×10-6m joints produced a large degree of scatter in the strength values
Keywords :
accelerometers; assembling; electric sensing devices; electron device manufacture; piezoelectric transducers; quartz; soldering; 0.5 to 2 micron; AuGe-SiO2; bulk film composition; electron beam deposition; eutectic composition; piezoelectric sensor assembly; quartz/Au-Ge/quartz bonds; single-crystal quartz accelerometer; solder technology; thermal cycle exposures; thermal shock; Accelerometers; Assembly; Bonding; Ceramics; Electric shock; Frequency; Gold; Piezoelectric films; Thermal expansion; Vibrations;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Frequency Control, 1991., Proceedings of the 45th Annual Symposium on
Conference_Location :
Los Angeles, CA
Print_ISBN :
0-87942-658-6
Type :
conf
DOI :
10.1109/FREQ.1991.145912
Filename :
145912
Link To Document :
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