• DocumentCode
    3445807
  • Title

    Analysis of the electrical characteristics of novel ESD protection device with high holding voltage under various temperatures

  • Author

    Koo, Yong Seo ; Lee, Hyun Duck ; Won, Jong Il ; Yang, Yil Suk

  • Author_Institution
    Dept. of Electron. & Electr. Eng., Dankook Univ., Seoul, South Korea
  • fYear
    2010
  • fDate
    21-24 June 2010
  • Firstpage
    248
  • Lastpage
    251
  • Abstract
    The paper introduces a silicon controlled rectifier (SCR)-based device with high holding voltage for ESD power clamp. The holding voltage can be increased by extending a p+ cathode to the first n-well and adding second n-well wrapping around n+ cathode. The increase of the holding voltage above the supply voltage enables latch-up immune normal operation. The device is fabricated by 0.35um BCD (Bipolar-CMOS-DMOS) technology and investigated not only the electrical characteristics, but also temperature dependence of holding voltage/current in a wide temperature range from 300 K to 500 K. In the measurement result, the proposed device has holding voltage of 8 V and second breakdown current of 80mA/um. At high temperature condition of above 400 K, the holding voltage, holding current and second breakdown current of the proposed device rapidly decrease.
  • Keywords
    CMOS integrated circuits; bipolar integrated circuits; electrostatic discharge; thyristors; BCD technology; Bipolar-CMOS-DMOS technology; ESD power clamp; ESD protection device; SCR-based device; electrical characteristics; holding current temperature dependence; holding voltage temperature dependence; latch-up immune normal operation; n cathode; p cathode; silicon controlled rectifier; Breakdown voltage; Cathodes; Clamps; Electric variables; Electrostatic discharge; Protection; Temperature dependence; Temperature distribution; Thyristors; Wrapping; ESD; SCR; high holding; trigger;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics Conference (IPEC), 2010 International
  • Conference_Location
    Sapporo
  • Print_ISBN
    978-1-4244-5394-8
  • Type

    conf

  • DOI
    10.1109/IPEC.2010.5542284
  • Filename
    5542284