Title :
Method for solder bonding CPV receiver to heat sink
Author :
Duckham, Alan ; He, Zhaojuan
Author_Institution :
Reactive Nanotechnol., Hunt Valley, MD, USA
Abstract :
This paper will describe a technology and process for providing reduced thermal resistance between CPV receivers and heat sinks, resulting in improved thermal performance and increased life span for the system.
Keywords :
bonding processes; heat sinks; solar cells; solar energy concentrators; soldering; thermal resistance; CPV receiver; heat sink; solder bonding; thermal performance; thermal resistance; Bonding; Heat sinks;
Conference_Titel :
Photovoltaic Specialists Conference (PVSC), 2009 34th IEEE
Conference_Location :
Philadelphia, PA
Print_ISBN :
978-1-4244-2949-3
Electronic_ISBN :
0160-8371
DOI :
10.1109/PVSC.2009.5411529
