Title :
A fuzzy logic method on IC lead-frame surface inspection
Author :
Li, Jimin ; Oh, Weon-Geun ; Park, Chang-Joon ; Kim, Hyeon-Jin
Author_Institution :
Dept. of Image Process., Electron. & Telecommun. Res. Inst., Taejon, South Korea
Abstract :
The inspection of lead-frame is important in semiconductor industry. During the production process, the quality control of lead-frame plays an important role. Here we introduce a method for inspection of contamination and plating quality of lead frame. The basic method of segmentation of interested lead surface into five classes is discussed based on the samples supplied from IC manufacturing company. A two-stage inspection method is introduced based on the basic five classes. The discussion of the system realization and experimental results show the idea.
Keywords :
automatic optical inspection; fuzzy logic; image segmentation; integrated circuit manufacture; lead bonding; quality control; IC lead-frame surface inspection; QC; contamination inspection; fuzzy logic method; image segmentation; plating quality inspection; quality control; semiconductor industry; two-stage inspection method; Computer science; Fuzzy logic; Image processing; Inspection; Laboratories; Lead compounds; Pattern recognition; Photonic integrated circuits; Production; Shape;
Conference_Titel :
Fuzzy Systems Conference Proceedings, 1999. FUZZ-IEEE '99. 1999 IEEE International
Conference_Location :
Seoul, South Korea
Print_ISBN :
0-7803-5406-0
DOI :
10.1109/FUZZY.1999.793109
