DocumentCode
3446538
Title
2005 IEEE International Integrated Reliability Workshop Final Report (IEEE Cat. No.05TH8799)
fYear
2005
fDate
17-20 Oct. 2005
Abstract
The following topics are dealt with: oxide reliability; high-K properties; negative bias temperature instability; interconnect reliability; product reliability; MEMS; flash memory; radiation effects; and reliability statistics
Keywords
dielectric properties; flash memories; integrated circuit interconnections; integrated circuit reliability; micromechanical devices; radiation effects; MEMS; flash memory; high-K properties; interconnect reliability; negative bias temperature instability; oxide reliability; product reliability; radiation effects; reliability statistics;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report, 2005 IEEE International
Conference_Location
S. Lake Tahoe, CA
Print_ISBN
0-7803-8992-1
Type
conf
DOI
10.1109/IRWS.2005.1609544
Filename
1609544
Link To Document