Title :
2005 IEEE International Integrated Reliability Workshop Final Report (IEEE Cat. No.05TH8799)
Abstract :
The following topics are dealt with: oxide reliability; high-K properties; negative bias temperature instability; interconnect reliability; product reliability; MEMS; flash memory; radiation effects; and reliability statistics
Keywords :
dielectric properties; flash memories; integrated circuit interconnections; integrated circuit reliability; micromechanical devices; radiation effects; MEMS; flash memory; high-K properties; interconnect reliability; negative bias temperature instability; oxide reliability; product reliability; radiation effects; reliability statistics;
Conference_Titel :
Integrated Reliability Workshop Final Report, 2005 IEEE International
Conference_Location :
S. Lake Tahoe, CA
Print_ISBN :
0-7803-8992-1
DOI :
10.1109/IRWS.2005.1609544
