Title :
1996 International Integrated Reliability Workshop Final Report
Abstract :
The following topics were dealt with: wafer level reliability; building in reliability; interconnect reliability; thin oxide reliability; metallization structures; failure analysis
Keywords :
integrated circuit reliability; reliability; building in reliability; failure analysis; integrated circuit; interconnect reliability; metallization; thin oxide reliability; wafer level reliability;
Conference_Titel :
Integrated Reliability Workshop, 1996., IEEE International
Conference_Location :
Lake Tahoe, CA, USA
Print_ISBN :
0-7803-3598-8
DOI :
10.1109/IRWS.1996.583373
