• DocumentCode
    3446605
  • Title

    Does building-in reliability imply more or less wafer-level reliability testing?

  • Author

    McPherson, J.W.

  • Author_Institution
    Texas Instrum. Inc., Dallas, TX, USA
  • fYear
    1996
  • fDate
    20-23 Oct 1996
  • Firstpage
    1
  • Lastpage
    15
  • Abstract
    Wafer-level reliability (WLR) testing continues to be an important tool for implementing a building-in reliability (BIR) strategy. The thrust of WLR testing has shifted, however, from the back-of-the-line (monitoring of outgoing reliability levels) to the front-of-the-line (margin testing during the development and productization phase). The rapid nature of most WLR tests permits the process engineer to evaluate the impact of process variation and obtain an “almost instantaneous” feedback as to its reliability impact. Rapid reliability information feedback is a key to helping the process engineer to build reliability into the technology. This is extremely important today when technologies are being developed and introduced to fabs at a rapid rate
  • Keywords
    integrated circuit manufacture; integrated circuit reliability; integrated circuit testing; production testing; building-in reliability strategy; margin testing; process variation; reliability information feedback; wafer-level reliability testing; Assembly; Feedback; Instruments; Integrated circuit reliability; Process design; Reliability engineering; Robustness; Temperature; Testing; Ultra large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop, 1996., IEEE International
  • Conference_Location
    Lake Tahoe, CA
  • Print_ISBN
    0-7803-3598-8
  • Type

    conf

  • DOI
    10.1109/IRWS.1996.583375
  • Filename
    583375