DocumentCode
3446605
Title
Does building-in reliability imply more or less wafer-level reliability testing?
Author
McPherson, J.W.
Author_Institution
Texas Instrum. Inc., Dallas, TX, USA
fYear
1996
fDate
20-23 Oct 1996
Firstpage
1
Lastpage
15
Abstract
Wafer-level reliability (WLR) testing continues to be an important tool for implementing a building-in reliability (BIR) strategy. The thrust of WLR testing has shifted, however, from the back-of-the-line (monitoring of outgoing reliability levels) to the front-of-the-line (margin testing during the development and productization phase). The rapid nature of most WLR tests permits the process engineer to evaluate the impact of process variation and obtain an “almost instantaneous” feedback as to its reliability impact. Rapid reliability information feedback is a key to helping the process engineer to build reliability into the technology. This is extremely important today when technologies are being developed and introduced to fabs at a rapid rate
Keywords
integrated circuit manufacture; integrated circuit reliability; integrated circuit testing; production testing; building-in reliability strategy; margin testing; process variation; reliability information feedback; wafer-level reliability testing; Assembly; Feedback; Instruments; Integrated circuit reliability; Process design; Reliability engineering; Robustness; Temperature; Testing; Ultra large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop, 1996., IEEE International
Conference_Location
Lake Tahoe, CA
Print_ISBN
0-7803-3598-8
Type
conf
DOI
10.1109/IRWS.1996.583375
Filename
583375
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