Combined topography and AC field probing with a micromachined SFM tip for building in reliability

Author

van der Weide, D.W. ; Neuzil, P. ; Bork, T. ; Bergey, J.

Author_Institution

Dept. of Electr. Eng., Delaware Univ., Newark, DE, USA

fYear

1996

fDate

20-23 Oct 1996

Firstpage

27

Lastpage

30

Abstract

We introduce a new concept for combined probing of topography and local AC fields and report some early results of tip fabrication and measurements. Because this instrument can be used to measure both AC fields and topography with nanometer-level localization, we call it a Nanoscilloscope. This new instrument promises to be particularly useful for proactive reliability engineering because it can simultaneously image dynamic electric fields (i.e. signals) and sample topography, but unlike electron-beam probing, it operates in ambient conditions

Keywords

electric field measurement; integrated circuit reliability; integrated circuit testing; micromachining; nanotechnology; scanning probe microscopy; surface topography measurement; AC field probing; Nanoscilloscope; building in reliability; dynamic electric field imaging; micromachined SFM tip; nanometer-level localization; semiconductor IC; topography probing; Circuit testing; Coaxial components; Force measurement; Frequency measurement; Instruments; Integrated circuit measurements; Optical surface waves; Optical waveguides; Probes; Surface topography;

fLanguage

English

Publisher

ieee

Conference_Titel

Integrated Reliability Workshop, 1996., IEEE International

Conference_Location

Lake Tahoe, CA

Print_ISBN

0-7803-3598-8

Type

conf

DOI

10.1109/IRWS.1996.583378

Filename

583378