• DocumentCode
    3446666
  • Title

    Shear test for adhesion measurement of small structures

  • Author

    Schammler, G. ; Buschick, K. ; Hahn, R. ; Reichl, H.

  • Author_Institution
    Fraunhofer Inst. Zuverlassigkeit und Mikrointegration, Berlin, Germany
  • fYear
    1996
  • fDate
    20-23 Oct 1996
  • Firstpage
    31
  • Lastpage
    36
  • Abstract
    In this study adhesion measurements using shear testing and investigation of the failure mode were carried out. We determined the average shear force of small polyimide structures on metal or oxide surfaces and of metal bumps on sputtered metal layers. Results show clearly, that the type of polyimide has an influence on average shear force for polyimides on metal or oxide surfaces and that sputter conditions can influence the average shear force of the metal layer. The location of fracture is also influenced by the type of combination of polyimide and substrate. Temperature cycling and temperature-humidity testing show a greater influence on average shear force for the polymer specimen than for the sputtered layers. The shear test could be used for occasional monitoring or for routine production monitoring
  • Keywords
    adhesion; failure analysis; fracture; life testing; multichip modules; polymer films; production testing; sputtering; MCMs; adhesion measurement; average shear force; failure mode; fracture; metal bumps; polyimide structures; production monitoring; shear test; sputter conditions; temperature cycling; temperature-humidity testing; Adhesives; Force measurement; Monitoring; Polyimides; Polymers; Production; Resists; Surface cracks; Testing; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop, 1996., IEEE International
  • Conference_Location
    Lake Tahoe, CA
  • Print_ISBN
    0-7803-3598-8
  • Type

    conf

  • DOI
    10.1109/IRWS.1996.583379
  • Filename
    583379