Title :
Electrical characteristics of wedge-shaped gate-oxide in recessed-LOCOS
Author :
Woo, Young-Tag ; Hwang, Chi-Sun ; Hong, Sung-Joo ; Chung, In-Sul
Author_Institution :
Memory R&D Div., Hyundai Electron. Ind. Co., Kyoungki, South Korea
Abstract :
An analytical solution of the electric potential and field for the wedge-shaped gate-oxide, which is formed inevitably in recessed-LOCOS structure, is proposed. This abnormal geometry includes an apex, which brings about an electrical failure during the gate-bias test. First, we show that the apex angles change according to the thickness of the sidewall nitride spacer by process simulation and physical arguments. We model the wedge-shaped gate-oxide in a simple geometry and calculate the electric potential and field with the various apex angles. We calculate the resultant tunneling current using the Fowler-Nordheim model. As the result of the calculation, we prove that above a certain spacer thickness, the breakdown voltage fluctuates from site to site within a wafer in gate-bias test with the memory cell array pattern. We predict that this breakdown phenomenon occurs regardless of the gate-oxide thickness and also suggest the presence of the limiting apex angle to maintain the gate-oxide reliability
Keywords :
DRAM chips; cellular arrays; electric potential; failure analysis; integrated circuit modelling; integrated circuit reliability; integrated circuit testing; isolation technology; tunnelling; DRAMs; Fowler-Nordheim model; apex angles; breakdown voltage; electric potential; electrical failure; gate-bias test; gate-oxide reliability; isolation process; memory cell array pattern; process simulation; recessed-LOCOS; sidewall nitride spacer; tunneling current; wedge-shaped gate-oxide; Electric breakdown; Electric potential; Electric variables; Geometry; Maintenance; Semiconductor device modeling; Silicon; Solid modeling; Testing; Tunneling;
Conference_Titel :
Integrated Reliability Workshop, 1996., IEEE International
Conference_Location :
Lake Tahoe, CA
Print_ISBN :
0-7803-3598-8
DOI :
10.1109/IRWS.1996.583380