New Millennium DS2 electronic packaging an advanced electronic packaging “sandbox”

Author

Arakaki, Genji ; D´Agostino, Saverio

Author_Institution

Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA

Volume

2

fYear

1999

fDate

1999

Firstpage

205

Abstract

New Millennium Deep Space 2 (DS2), managed by the Jet Propulsion Laboratory (JPL), consists of a pair of probes that will be carried to Mars by the Mars Polar Lander. After release from the Lander, both probes enter the atmosphere, impact and penetrate the Martian surface. After impact, a soil sample is taken and analyzed for the presence of water. Other scientific data is collected during descent and after impact. The proposed size and mass of the probes imposed enormous constraints on the packaging of the electronics. To fit the electronics within the probe envelope, the DS2 became a virtual advanced packaging experiment: Chip-on-Board (COB) technology, High Density Interconnect (HDI) technology, and novel flexible interconnects were used in a highly integrated package to meet the requirements. This paper describes the development and testing of the DS2 electronics package and possible follow-on developments at JPL

Keywords

Mars; chip-on-board packaging; integrated circuit interconnections; planetary surfaces; space research; space vehicles; surface mount technology; DS2 electronic packaging; DS2 electronics package; Jet Propulsion Laboratory; Mars Polar Lander; Martian surface; Millennium Deep Space 2; SMT; chip-on-board technology; flexible interconnects; high density interconnect technology; integrated package; probes; scientific data; soil sample; water; Assembly; Atmosphere; Electronic equipment testing; Electronics packaging; Laboratories; Mars; Probes; Propulsion; Soil; Space technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Aerospace Conference, 1999. Proceedings. 1999 IEEE

Conference_Location

Snowmass at Aspen, CO

Print_ISBN

0-7803-5425-7

Type

conf

DOI

10.1109/AERO.1999.793162

Filename

793162