Title :
New Millennium DS2 electronic packaging an advanced electronic packaging “sandbox”
Author :
Arakaki, Genji ; D´Agostino, Saverio
Author_Institution :
Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
Abstract :
New Millennium Deep Space 2 (DS2), managed by the Jet Propulsion Laboratory (JPL), consists of a pair of probes that will be carried to Mars by the Mars Polar Lander. After release from the Lander, both probes enter the atmosphere, impact and penetrate the Martian surface. After impact, a soil sample is taken and analyzed for the presence of water. Other scientific data is collected during descent and after impact. The proposed size and mass of the probes imposed enormous constraints on the packaging of the electronics. To fit the electronics within the probe envelope, the DS2 became a virtual advanced packaging experiment: Chip-on-Board (COB) technology, High Density Interconnect (HDI) technology, and novel flexible interconnects were used in a highly integrated package to meet the requirements. This paper describes the development and testing of the DS2 electronics package and possible follow-on developments at JPL
Keywords :
Mars; chip-on-board packaging; integrated circuit interconnections; planetary surfaces; space research; space vehicles; surface mount technology; DS2 electronic packaging; DS2 electronics package; Jet Propulsion Laboratory; Mars Polar Lander; Martian surface; Millennium Deep Space 2; SMT; chip-on-board technology; flexible interconnects; high density interconnect technology; integrated package; probes; scientific data; soil sample; water; Assembly; Atmosphere; Electronic equipment testing; Electronics packaging; Laboratories; Mars; Probes; Propulsion; Soil; Space technology;
Conference_Titel :
Aerospace Conference, 1999. Proceedings. 1999 IEEE
Conference_Location :
Snowmass at Aspen, CO
Print_ISBN :
0-7803-5425-7
DOI :
10.1109/AERO.1999.793162
