Title :
A new degradation mode for advanced heterojunction bipolar transistors under reverse bias stress
Author :
Ruat, M. ; Angers, R. ; Ghibaudo, G. ; Revil, N. ; Pananakakis, G.
Abstract :
This work shows and discusses the occurrence of a new failure mechanism affecting both collector and base currents under reverse BE junction stress. This is evident for very advanced SiGe and SiGe:C HBTs. This failure mode only affects the first steps of the degradation, exhibiting a correlated decrease of both base and collector currents, while keeping their ideality. Several experiments and analyses have been conducted for better understanding of this failure mode
Keywords :
Ge-Si alloys; carbon; failure analysis; heterojunction bipolar transistors; semiconductor device reliability; SiGe:C; base current; collector current; degradation mode; failure mechanism; failure mode; heterojunction bipolar transistors; reverse BE junction stress; reverse bias stress; CMOS technology; Degradation; Doping profiles; Failure analysis; Germanium silicon alloys; Heterojunction bipolar transistors; Hot carriers; Isolation technology; Silicon germanium; Stress;
Conference_Titel :
Integrated Reliability Workshop Final Report, 2005 IEEE International
Conference_Location :
S. Lake Tahoe, CA
Print_ISBN :
0-7803-8992-1
DOI :
10.1109/IRWS.2005.1609563