DocumentCode :
3446950
Title :
Charge retention of silicided and unsilicided floating gates in embedded logic nonvolatile memory
Author :
Wang, Bin ; Nguyen, Hoc ; Horch, Andy ; Ma, Yanjun ; Paulsen, Ron
Author_Institution :
Technol. Dev., Impinj Inc., Seattle, WA, USA
fYear :
2005
fDate :
17-20 Oct. 2005
Abstract :
Some researchers have previously reported that silicide-blocking layers play a key role in retaining charge in embedded DRAM and Flash memory technologies. In this paper, we investigate the retention characteristics for silicided and unsilicided floating gates embedded logic NVM fabricated in a standard 0.25μm logic process. In contrast to previous reports, it is found in this work that silicided and unsilicided NVM have equivalent retention for cycled and un-cycled arrays with temperature bake up to 6120 hrs at 135°C. As a result, there is more flexibility in optimizing the memory cell area for logic NVM by removing the silicide-blocking layer.
Keywords :
embedded systems; logic gates; random-access storage; 0.25 micron; 135 C; charge retention; embedded DRAM; embedded logic nonvolatile memory; flash memory; silicide-blocking layers; silicided floating gates; unsilicided floating gates; Circuits; Electrons; Flash memory; Logic gates; MOSFETs; Nonvolatile memory; Random access memory; Silicides; Silicon; Tunneling; DRSL; HTOL; NVM; floating-gate; retention; silicided; unsilicided;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report, 2005 IEEE International
Print_ISBN :
0-7803-8992-1
Type :
conf
DOI :
10.1109/IRWS.2005.1609565
Filename :
1609565
Link To Document :
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