DocumentCode :
3447008
Title :
Impact of boron penetration at the p+-poly/gate-oxide interface on the device reliability of deep submicron CMOS logic technology
Author :
Nayak, Deepak K. ; Ming-Yin Hao ; Rakkhit, Rajat
Author_Institution :
Div. of Logic Technol., Adv. Micro Devices Inc., Sunnyvale, CA, USA
fYear :
1996
fDate :
20-23 Oct 1996
Firstpage :
116
Lastpage :
118
Abstract :
Impact of boron penetration at the p+-poly/gate-oxide interface is investigated. It is shown that the onset of boron penetration at this interface can not be detected by conventional threshold or flatband voltage shifts of p-channel devices, but it results in significantly lower QBD and Vt instability. Constant current stress in inversion has been found to be most sensitive technique to monitor the onset of boron at the p+-poly/gate-oxide interface
Keywords :
CMOS logic circuits; boron; chemical interdiffusion; integrated circuit measurement; integrated circuit reliability; ion implantation; rapid thermal annealing; 975 to 1025 C; B penetration; BF2 implant energy; QBD; RTA; Si:B-SiO2:B; constant current stress in inversion; deep submicron CMOS logic technology; device reliability; gate oxide reliability; p-channel devices; p+-poly/gate-oxide interface; threshold voltage instability; Annealing; Boron; CMOS technology; Capacitance; Capacitance-voltage characteristics; Degradation; Design for quality; Implants; Temperature; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop, 1996., IEEE International
Conference_Location :
Lake Tahoe, CA
Print_ISBN :
0-7803-3598-8
Type :
conf
DOI :
10.1109/IRWS.1996.583395
Filename :
583395
Link To Document :
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