• DocumentCode
    3447030
  • Title

    Charge instability in high-k gate stacks with metal and polysilicon electrodes

  • Author

    Neugroschel, A. ; Bersuker, G.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Florida Univ., Gainesville, FL, USA
  • fYear
    2005
  • fDate
    17-20 Oct. 2005
  • Abstract
    Charge trapping in high-k transistor gate stacks shifts the threshold voltage and may affect the channel mobility. Since both electrons and holes may potentially contribute to charge trapping, it is important to determine the polarity of the trapped charge and to relate it to the stress or operating conditions. A constant-voltage stress was applied to nMOSFETs and pMOSFETs and the charge trapping in the gate stack and the interface trap generation was monitored by the DCIV method. Detailed band diagram for each stress condition is used to correlate the measured charge trapping and the interface trap generation/annihilation to the dominant tunneling current component and to delineate the physical mechanisms and charge-trapping pathways.
  • Keywords
    MOSFET; dielectric materials; electron traps; hole traps; semiconductor device reliability; tunnelling; DCIV method; channel mobility; charge instability; charge polarity; charge trapping; constant-voltage stress; dominant tunneling current component; electron traps; high-k transistor gate stacks; hole traps; interface trap annihilation; interface trap generation; metal electrodes; nMOSFET; pMOSFET; polysilicon electrodes; threshold voltage; Charge carrier processes; Charge measurement; Current measurement; Electrodes; Electron traps; High K dielectric materials; High-K gate dielectrics; MOSFETs; Stress; Threshold voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report, 2005 IEEE International
  • Print_ISBN
    0-7803-8992-1
  • Type

    conf

  • DOI
    10.1109/IRWS.2005.1609569
  • Filename
    1609569