DocumentCode
3447030
Title
Charge instability in high-k gate stacks with metal and polysilicon electrodes
Author
Neugroschel, A. ; Bersuker, G.
Author_Institution
Dept. of Electr. & Comput. Eng., Florida Univ., Gainesville, FL, USA
fYear
2005
fDate
17-20 Oct. 2005
Abstract
Charge trapping in high-k transistor gate stacks shifts the threshold voltage and may affect the channel mobility. Since both electrons and holes may potentially contribute to charge trapping, it is important to determine the polarity of the trapped charge and to relate it to the stress or operating conditions. A constant-voltage stress was applied to nMOSFETs and pMOSFETs and the charge trapping in the gate stack and the interface trap generation was monitored by the DCIV method. Detailed band diagram for each stress condition is used to correlate the measured charge trapping and the interface trap generation/annihilation to the dominant tunneling current component and to delineate the physical mechanisms and charge-trapping pathways.
Keywords
MOSFET; dielectric materials; electron traps; hole traps; semiconductor device reliability; tunnelling; DCIV method; channel mobility; charge instability; charge polarity; charge trapping; constant-voltage stress; dominant tunneling current component; electron traps; high-k transistor gate stacks; hole traps; interface trap annihilation; interface trap generation; metal electrodes; nMOSFET; pMOSFET; polysilicon electrodes; threshold voltage; Charge carrier processes; Charge measurement; Current measurement; Electrodes; Electron traps; High K dielectric materials; High-K gate dielectrics; MOSFETs; Stress; Threshold voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report, 2005 IEEE International
Print_ISBN
0-7803-8992-1
Type
conf
DOI
10.1109/IRWS.2005.1609569
Filename
1609569
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