DocumentCode :
3447151
Title :
Discussion Group Summary Wafer-level Reliability Techniques
Author :
Pierce, D.G.
Author_Institution :
Sandia Technologies, Inc.
fYear :
1996
fDate :
20-23 Oct. 1996
Firstpage :
159
Lastpage :
160
Keywords :
Dielectrics; Diodes; Monitoring; Passivation; Plasma applications; Process control; Production; Qualifications; Research and development; Standardization;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop, 1996., IEEE International
Conference_Location :
Lake Tahoe, CA, USA
Print_ISBN :
0-7803-3598-8
Type :
conf
DOI :
10.1109/IRWS.1996.583401
Filename :
583401
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3447151
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