DocumentCode :
3447175
Title :
Discussion Group Summary Interconnect Reiiability
Author :
Sullivan, Timothy
Author_Institution :
IBM Microelectronics
fYear :
1996
fDate :
20-23 Oct. 1996
Firstpage :
163
Lastpage :
163
Keywords :
Circuit testing; Copper alloys; Electromigration; Hardware; Isothermal processes; Metallization; NIST; Polyimides; Qualifications; Temperature dependence;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop, 1996., IEEE International
Conference_Location :
Lake Tahoe, CA, USA
Print_ISBN :
0-7803-3598-8
Type :
conf
DOI :
10.1109/IRWS.1996.583403
Filename :
583403
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3447175
