DocumentCode

3447175

Title

Discussion Group Summary Interconnect Reiiability

Author

Sullivan, Timothy

Author_Institution

IBM Microelectronics

fYear

1996

fDate

20-23 Oct. 1996

Firstpage

163

Lastpage

163

Keywords

Circuit testing; Copper alloys; Electromigration; Hardware; Isothermal processes; Metallization; NIST; Polyimides; Qualifications; Temperature dependence;

fLanguage

English

Publisher

ieee

Conference_Titel

Integrated Reliability Workshop, 1996., IEEE International

Conference_Location

Lake Tahoe, CA, USA

Print_ISBN

0-7803-3598-8

Type

conf

DOI

10.1109/IRWS.1996.583403

Filename

583403